Throughput improvement in semiconductor fabrication for 0.13μm technology

Puvaneswaran Balakrishna, Mohd Azizi Chik, Ibrahim Ahmad, Bashir Mohamad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Semiconductor fabrication is known to be the one of the most complex manufacturing operations. This is due to total processing steps in semiconductor fabrication is as high as 1000 steps and the process will re-enter through same equipments multiple times. This will always pose a challenge to the operational team to achieve goal for optimal cycle time and maximum output. One of the WIP (Work In Progress) management approach used to achieve this goal is to use the right WIP prioritization. In general, giving priority to respective WIP usually will result in faster cycle time to fulfill customer expectation. This is done by identifying specific products as priority 1 to be executed first and priority 2 next. The methodology in this research uses simulation software to configure a real 200mm semiconductor fabrication facility. The input parameters used in this analysis include technology product specification, products demand based on real market trend, manufacturing, and equipment specification and requirements. The results from this study re-instate that prioritization has direct impact to the overall product cycle time and monthly wafer output. The results in this study also shows that categorizing product into two types of priorities will improve the cycle time by 2.21% and monthly wafer output will increase by 2.1% compared to when the WIP were managed by the same priority. In conclusion, this is desirable because increasing 2.1% monthly output can easily contribute to increase revenue of more than USD 4 million per year, which is vital for company's survival in this competitive business.

Original languageEnglish
Title of host publication2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts
Pages228-231
Number of pages4
DOIs
Publication statusPublished - 22 Dec 2011
Event2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011 - Kota Kinabalu, Sabah, Malaysia
Duration: 28 Sep 201130 Sep 2011

Publication series

Name2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts

Other

Other2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011
CountryMalaysia
CityKota Kinabalu, Sabah
Period28/09/1130/09/11

Fingerprint

Throughput
Semiconductor materials
Fabrication
Specifications
Industry
Processing

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Balakrishna, P., Chik, M. A., Ahmad, I., & Mohamad, B. (2011). Throughput improvement in semiconductor fabrication for 0.13μm technology. In 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts (pp. 228-231). [6088330] (2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts). https://doi.org/10.1109/RSM.2011.6088330
Balakrishna, Puvaneswaran ; Chik, Mohd Azizi ; Ahmad, Ibrahim ; Mohamad, Bashir. / Throughput improvement in semiconductor fabrication for 0.13μm technology. 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. pp. 228-231 (2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts).
@inproceedings{60362b0e026c4f32bffb59ea56623c74,
title = "Throughput improvement in semiconductor fabrication for 0.13μm technology",
abstract = "Semiconductor fabrication is known to be the one of the most complex manufacturing operations. This is due to total processing steps in semiconductor fabrication is as high as 1000 steps and the process will re-enter through same equipments multiple times. This will always pose a challenge to the operational team to achieve goal for optimal cycle time and maximum output. One of the WIP (Work In Progress) management approach used to achieve this goal is to use the right WIP prioritization. In general, giving priority to respective WIP usually will result in faster cycle time to fulfill customer expectation. This is done by identifying specific products as priority 1 to be executed first and priority 2 next. The methodology in this research uses simulation software to configure a real 200mm semiconductor fabrication facility. The input parameters used in this analysis include technology product specification, products demand based on real market trend, manufacturing, and equipment specification and requirements. The results from this study re-instate that prioritization has direct impact to the overall product cycle time and monthly wafer output. The results in this study also shows that categorizing product into two types of priorities will improve the cycle time by 2.21{\%} and monthly wafer output will increase by 2.1{\%} compared to when the WIP were managed by the same priority. In conclusion, this is desirable because increasing 2.1{\%} monthly output can easily contribute to increase revenue of more than USD 4 million per year, which is vital for company's survival in this competitive business.",
author = "Puvaneswaran Balakrishna and Chik, {Mohd Azizi} and Ibrahim Ahmad and Bashir Mohamad",
year = "2011",
month = "12",
day = "22",
doi = "10.1109/RSM.2011.6088330",
language = "English",
isbn = "9781612848464",
series = "2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts",
pages = "228--231",
booktitle = "2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts",

}

Balakrishna, P, Chik, MA, Ahmad, I & Mohamad, B 2011, Throughput improvement in semiconductor fabrication for 0.13μm technology. in 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts., 6088330, 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts, pp. 228-231, 2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011, Kota Kinabalu, Sabah, Malaysia, 28/09/11. https://doi.org/10.1109/RSM.2011.6088330

Throughput improvement in semiconductor fabrication for 0.13μm technology. / Balakrishna, Puvaneswaran; Chik, Mohd Azizi; Ahmad, Ibrahim; Mohamad, Bashir.

2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. p. 228-231 6088330 (2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Throughput improvement in semiconductor fabrication for 0.13μm technology

AU - Balakrishna, Puvaneswaran

AU - Chik, Mohd Azizi

AU - Ahmad, Ibrahim

AU - Mohamad, Bashir

PY - 2011/12/22

Y1 - 2011/12/22

N2 - Semiconductor fabrication is known to be the one of the most complex manufacturing operations. This is due to total processing steps in semiconductor fabrication is as high as 1000 steps and the process will re-enter through same equipments multiple times. This will always pose a challenge to the operational team to achieve goal for optimal cycle time and maximum output. One of the WIP (Work In Progress) management approach used to achieve this goal is to use the right WIP prioritization. In general, giving priority to respective WIP usually will result in faster cycle time to fulfill customer expectation. This is done by identifying specific products as priority 1 to be executed first and priority 2 next. The methodology in this research uses simulation software to configure a real 200mm semiconductor fabrication facility. The input parameters used in this analysis include technology product specification, products demand based on real market trend, manufacturing, and equipment specification and requirements. The results from this study re-instate that prioritization has direct impact to the overall product cycle time and monthly wafer output. The results in this study also shows that categorizing product into two types of priorities will improve the cycle time by 2.21% and monthly wafer output will increase by 2.1% compared to when the WIP were managed by the same priority. In conclusion, this is desirable because increasing 2.1% monthly output can easily contribute to increase revenue of more than USD 4 million per year, which is vital for company's survival in this competitive business.

AB - Semiconductor fabrication is known to be the one of the most complex manufacturing operations. This is due to total processing steps in semiconductor fabrication is as high as 1000 steps and the process will re-enter through same equipments multiple times. This will always pose a challenge to the operational team to achieve goal for optimal cycle time and maximum output. One of the WIP (Work In Progress) management approach used to achieve this goal is to use the right WIP prioritization. In general, giving priority to respective WIP usually will result in faster cycle time to fulfill customer expectation. This is done by identifying specific products as priority 1 to be executed first and priority 2 next. The methodology in this research uses simulation software to configure a real 200mm semiconductor fabrication facility. The input parameters used in this analysis include technology product specification, products demand based on real market trend, manufacturing, and equipment specification and requirements. The results from this study re-instate that prioritization has direct impact to the overall product cycle time and monthly wafer output. The results in this study also shows that categorizing product into two types of priorities will improve the cycle time by 2.21% and monthly wafer output will increase by 2.1% compared to when the WIP were managed by the same priority. In conclusion, this is desirable because increasing 2.1% monthly output can easily contribute to increase revenue of more than USD 4 million per year, which is vital for company's survival in this competitive business.

UR - http://www.scopus.com/inward/record.url?scp=83755228671&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=83755228671&partnerID=8YFLogxK

U2 - 10.1109/RSM.2011.6088330

DO - 10.1109/RSM.2011.6088330

M3 - Conference contribution

SN - 9781612848464

T3 - 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts

SP - 228

EP - 231

BT - 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts

ER -

Balakrishna P, Chik MA, Ahmad I, Mohamad B. Throughput improvement in semiconductor fabrication for 0.13μm technology. In 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. p. 228-231. 6088330. (2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts). https://doi.org/10.1109/RSM.2011.6088330