Thermal stress test for PLED

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work presents thermal stability studies of PLEDs involving the comparison of electrical performance before and after thermal treatment. Two cycles of continuous thermal stress test from room temperature to 100 deg Celsius did not significantly affect the total photoluminescence intensity from the light-emitting polymer in the PLED suggesting that the layer of light-emitting polymer is intact. However, the rapid degradation of the electrical performance of the PLED right after the first cycle of thermal stress test suggests that the electrodes have degraded hence hindering charge injection into the polymeric layer.

Original languageEnglish
Title of host publicationICSE 2010 - Proceedings IEEE International Conference on Semiconductor Electronics
Pages370-372
Number of pages3
DOIs
Publication statusPublished - 2010
Event2010 IEEE International Conference on Semiconductor Electronics, ICSE 2010 - Melaka, Malaysia
Duration: 28 Jun 201030 Jun 2010

Other

Other2010 IEEE International Conference on Semiconductor Electronics, ICSE 2010
CountryMalaysia
CityMelaka
Period28/06/1030/06/10

Fingerprint

Thermal stress
Charge injection
Polymers
Photoluminescence
Thermodynamic stability
Heat treatment
Degradation
Electrodes
Temperature
N,N'-dipyridoxylethylenediamine-N,N'-diacetic acid

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Yap, B. K., Koh, J. S. P., Tiong, S. K., & Ong, C. N. (2010). Thermal stress test for PLED. In ICSE 2010 - Proceedings IEEE International Conference on Semiconductor Electronics (pp. 370-372). [5549354] https://doi.org/10.1109/SMELEC.2010.5549354
Yap, Boon Kar ; Koh, Johnny Siaw Paw ; Tiong, Sieh Kiong ; Ong, C. N. / Thermal stress test for PLED. ICSE 2010 - Proceedings IEEE International Conference on Semiconductor Electronics. 2010. pp. 370-372
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Yap, BK, Koh, JSP, Tiong, SK & Ong, CN 2010, Thermal stress test for PLED. in ICSE 2010 - Proceedings IEEE International Conference on Semiconductor Electronics., 5549354, pp. 370-372, 2010 IEEE International Conference on Semiconductor Electronics, ICSE 2010, Melaka, Malaysia, 28/06/10. https://doi.org/10.1109/SMELEC.2010.5549354

Thermal stress test for PLED. / Yap, Boon Kar; Koh, Johnny Siaw Paw; Tiong, Sieh Kiong; Ong, C. N.

ICSE 2010 - Proceedings IEEE International Conference on Semiconductor Electronics. 2010. p. 370-372 5549354.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Yap BK, Koh JSP, Tiong SK, Ong CN. Thermal stress test for PLED. In ICSE 2010 - Proceedings IEEE International Conference on Semiconductor Electronics. 2010. p. 370-372. 5549354 https://doi.org/10.1109/SMELEC.2010.5549354