The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition

Mohd Khairuddin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper reports the number of experiments that were designed to study the effects of aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). During this process, called as zincation, an oxide layer of aluminum will be replaced with a thin layer of zinc metal through the reduction and oxidation process. Zincation process is very important process to provide trustworthy interconnection of under bump metallurgy in advanced packaging. The study was carried out to determine the best conditions, through the various zincation exposure times and multiple zincation process to the surface topographic and morphology. In addition, for further understanding the effect of zincation process, the study includes of investigating aluminum dissolution rate and ball shear strength between eutectic Pb/Sn solder ball and under bump metallurgy (UBM) interfaces. Scanning Electron Microscope (SEM), Atomic Force Microscopy (AFM), Focus Ion Beam (FIB) and Intellectest STORM series FA1500 were used as analytical tools in this study. The result suggests, the triple zincation process consistently produces a smooth surface of ENIG UBM and consequently a better shear strength with only minimum aluminum dissolved.

Original languageEnglish
Title of host publication2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
Pages656-662
Number of pages7
Publication statusPublished - 2004
Event2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 - Kuala Lumpur, Malaysia
Duration: 04 Dec 200409 Dec 2004

Other

Other2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
CountryMalaysia
CityKuala Lumpur
Period04/12/0409/12/04

Fingerprint

Metallurgy
Gold
Nickel
Aluminum
Shear strength
Soldering alloys
Eutectics
Ion beams
Atomic force microscopy
Packaging
Dissolution
Zinc
Electron microscopes
Scanning
Oxidation
Oxides
Metals
Experiments

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Md Arshad, M. K., Ahmad, I., Jalar, A., & Omar, G. (2004). The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition. In 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 (pp. 656-662). [1620971]
Md Arshad, Mohd Khairuddin ; Ahmad, Ibrahim ; Jalar, Azman ; Omar, Ghazali. / The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition. 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004. 2004. pp. 656-662
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Md Arshad, MK, Ahmad, I, Jalar, A & Omar, G 2004, The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition. in 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004., 1620971, pp. 656-662, 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004, Kuala Lumpur, Malaysia, 04/12/04.

The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition. / Md Arshad, Mohd Khairuddin; Ahmad, Ibrahim; Jalar, Azman; Omar, Ghazali.

2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004. 2004. p. 656-662 1620971.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Md Arshad MK, Ahmad I, Jalar A, Omar G. The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition. In 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004. 2004. p. 656-662. 1620971