The effects of high temperature storage on lead free solder joint material strength using pull test method

Muhammad Najib Harif, Ibrahim Ahmad, Azami Zaharim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The purpose of this study is to discuss on the effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method. Three samples of different lead free solder joint material were choosed in this experiment that are Sn3.8Ag0.7Cu (SA C387), Sn2.3Ag0.08Ni 0.01Co (SANC), and Sn3.5Ag Then the lead free solder joint material samples were subjected to baking at 150°C for 24 hours, 48 hours, 96 hours and 168 hours. The Dage 4000 series pull test machine was used. Result show that the mean pull strength is 2847.66g 2628.20g and 2613.79g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5A g shows a significantly better solder joint performance in terms of joint strength compare than SANC and SAC387. Hence, three compositions show that joint strength decrease from 24hours condition to 168 hours at 150°C. In summary pull test method in this research manifestly show the feasibility to be used in characterization of lead free solder joint material for semiconductor or microelectronic packaging.

Original languageEnglish
Title of host publicationICSE 2006
Subtitle of host publication2006 IEEE International Conference on Semiconductor Electronics, Proceedings
Pages685-689
Number of pages5
DOIs
Publication statusPublished - 2006
Event2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006 - Kuala Lumpur, Malaysia
Duration: 29 Nov 200601 Dec 2006

Other

Other2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006
CountryMalaysia
CityKuala Lumpur
Period29/11/0601/12/06

Fingerprint

Ball grid arrays
Temperature
Microelectronics
Soldering alloys
Packaging
Semiconductor materials
Lead-free solders
Chemical analysis
Experiments

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Harif, M. N., Ahmad, I., & Zaharim, A. (2006). The effects of high temperature storage on lead free solder joint material strength using pull test method. In ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings (pp. 685-689). [4266705] https://doi.org/10.1109/SMELEC.2006.380722
Harif, Muhammad Najib ; Ahmad, Ibrahim ; Zaharim, Azami. / The effects of high temperature storage on lead free solder joint material strength using pull test method. ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings. 2006. pp. 685-689
@inproceedings{01edad53d6b641e4a7b871cc4fedce91,
title = "The effects of high temperature storage on lead free solder joint material strength using pull test method",
abstract = "The purpose of this study is to discuss on the effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method. Three samples of different lead free solder joint material were choosed in this experiment that are Sn3.8Ag0.7Cu (SA C387), Sn2.3Ag0.08Ni 0.01Co (SANC), and Sn3.5Ag Then the lead free solder joint material samples were subjected to baking at 150°C for 24 hours, 48 hours, 96 hours and 168 hours. The Dage 4000 series pull test machine was used. Result show that the mean pull strength is 2847.66g 2628.20g and 2613.79g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5A g shows a significantly better solder joint performance in terms of joint strength compare than SANC and SAC387. Hence, three compositions show that joint strength decrease from 24hours condition to 168 hours at 150°C. In summary pull test method in this research manifestly show the feasibility to be used in characterization of lead free solder joint material for semiconductor or microelectronic packaging.",
author = "Harif, {Muhammad Najib} and Ibrahim Ahmad and Azami Zaharim",
year = "2006",
doi = "10.1109/SMELEC.2006.380722",
language = "English",
isbn = "0780397312",
pages = "685--689",
booktitle = "ICSE 2006",

}

Harif, MN, Ahmad, I & Zaharim, A 2006, The effects of high temperature storage on lead free solder joint material strength using pull test method. in ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings., 4266705, pp. 685-689, 2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006, Kuala Lumpur, Malaysia, 29/11/06. https://doi.org/10.1109/SMELEC.2006.380722

The effects of high temperature storage on lead free solder joint material strength using pull test method. / Harif, Muhammad Najib; Ahmad, Ibrahim; Zaharim, Azami.

ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings. 2006. p. 685-689 4266705.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - The effects of high temperature storage on lead free solder joint material strength using pull test method

AU - Harif, Muhammad Najib

AU - Ahmad, Ibrahim

AU - Zaharim, Azami

PY - 2006

Y1 - 2006

N2 - The purpose of this study is to discuss on the effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method. Three samples of different lead free solder joint material were choosed in this experiment that are Sn3.8Ag0.7Cu (SA C387), Sn2.3Ag0.08Ni 0.01Co (SANC), and Sn3.5Ag Then the lead free solder joint material samples were subjected to baking at 150°C for 24 hours, 48 hours, 96 hours and 168 hours. The Dage 4000 series pull test machine was used. Result show that the mean pull strength is 2847.66g 2628.20g and 2613.79g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5A g shows a significantly better solder joint performance in terms of joint strength compare than SANC and SAC387. Hence, three compositions show that joint strength decrease from 24hours condition to 168 hours at 150°C. In summary pull test method in this research manifestly show the feasibility to be used in characterization of lead free solder joint material for semiconductor or microelectronic packaging.

AB - The purpose of this study is to discuss on the effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method. Three samples of different lead free solder joint material were choosed in this experiment that are Sn3.8Ag0.7Cu (SA C387), Sn2.3Ag0.08Ni 0.01Co (SANC), and Sn3.5Ag Then the lead free solder joint material samples were subjected to baking at 150°C for 24 hours, 48 hours, 96 hours and 168 hours. The Dage 4000 series pull test machine was used. Result show that the mean pull strength is 2847.66g 2628.20g and 2613.79g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5A g shows a significantly better solder joint performance in terms of joint strength compare than SANC and SAC387. Hence, three compositions show that joint strength decrease from 24hours condition to 168 hours at 150°C. In summary pull test method in this research manifestly show the feasibility to be used in characterization of lead free solder joint material for semiconductor or microelectronic packaging.

UR - http://www.scopus.com/inward/record.url?scp=35148901124&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=35148901124&partnerID=8YFLogxK

U2 - 10.1109/SMELEC.2006.380722

DO - 10.1109/SMELEC.2006.380722

M3 - Conference contribution

SN - 0780397312

SN - 9780780397316

SP - 685

EP - 689

BT - ICSE 2006

ER -

Harif MN, Ahmad I, Zaharim A. The effects of high temperature storage on lead free solder joint material strength using pull test method. In ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings. 2006. p. 685-689. 4266705 https://doi.org/10.1109/SMELEC.2006.380722