Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)

Zainudin Kornain, Ibrahim Ahmad, Ghazali Omar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The effect of temperature change to electrical resistivity of Aluminum bond pad (Al pad) on die surface of Under Bump Metallurgy (UBM) were discussed in this paper. Four categories of samples were involved in measurement; a sample without UBM and the samples with single, double and triple zincation process. The measurement of current-voltage curve of each sample was obtained by using special instrument so called RF probe and Metric ICS Software. The calculation of resistance and it pattern in the graph form was obtained by using Microsoft Office Excel. The temperature of sample was determined by using hot plate. Result from the graph has shown that the resistance of sample with UBM was less than resistance of the sample without UBM. It also has shown that the more zincation process steps the less value of resistance was attained. In other graph, the pattern has shown that value of resistance was increased when the temperature was raised up. As conclusion, the lower resistance due to zincation process and low temperature was produced better electrical performance especially the speed of operation and good thermal dissipation.

Original languageEnglish
Title of host publication2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
Pages451-455
Number of pages5
Publication statusPublished - 2004
Event2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 - Kuala Lumpur, Malaysia
Duration: 04 Dec 200409 Dec 2004

Other

Other2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
CountryMalaysia
CityKuala Lumpur
Period04/12/0409/12/04

Fingerprint

Metallurgy
Aluminum
Temperature
Electric potential

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Kornain, Z., Ahmad, I., & Omar, G. (2004). Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM). In 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 (pp. 451-455). [1620924]
Kornain, Zainudin ; Ahmad, Ibrahim ; Omar, Ghazali. / Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM). 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004. 2004. pp. 451-455
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Kornain, Z, Ahmad, I & Omar, G 2004, Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM). in 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004., 1620924, pp. 451-455, 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004, Kuala Lumpur, Malaysia, 04/12/04.

Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM). / Kornain, Zainudin; Ahmad, Ibrahim; Omar, Ghazali.

2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004. 2004. p. 451-455 1620924.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Kornain Z, Ahmad I, Omar G. Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM). In 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004. 2004. p. 451-455. 1620924