Study on reliability test of die attach material

Lim Chuan Yik, Boon Kar Yap, Nor Shafika

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing problem. But the characteristic and reliability of silver plated copper filler has be a doubt to replace the pure silver in the market. This paper will review few test method to test on the reliability of silver plated copper filler and proved that it is as good as silver to be the filler.

Original languageEnglish
Title of host publication2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2012
DOIs
Publication statusPublished - 01 Dec 2012
Event2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2012 - Ipoh, Perak, Malaysia
Duration: 06 Nov 201208 Nov 2012

Publication series

NameProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
ISSN (Print)1089-8190

Other

Other2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2012
CountryMalaysia
CityIpoh, Perak
Period06/11/1208/11/12

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All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Yik, L. C., Yap, B. K., & Shafika, N. (2012). Study on reliability test of die attach material. In 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2012 [6521776] (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium). https://doi.org/10.1109/IEMT.2012.6521776