Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top

Mohamed Mohd Salleh, Ibrahim Ahmad, Azman Jalar, Ghazali Omar, Siti Hajar Abdullah, Mohd Khairuddin Arshad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper will be discussed some aspects of surface morphology and elemental analysis on the solderability problem which caused non-wetting on top of die metallization layer. In this study few good and bad fresh die will be investigated along with the bad die which have non-wetting at die top. The surface analysis techniques will be used such as optical microscope and SEM to observe surface morphology. EDX investigation being done to determine the elements presents on the samples surface. Further details information using FIB also been performed. Contact angle analysis to measure the surface tension onto related area and FTIR analysis as support techniques.

Original languageEnglish
Title of host publication2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
Pages650-655
Number of pages6
Publication statusPublished - 01 Dec 2004
Event2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 - Kuala Lumpur, Malaysia
Duration: 04 Dec 200409 Dec 2004

Publication series

NameProceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics

Other

Other2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
CountryMalaysia
CityKuala Lumpur
Period04/12/0409/12/04

Fingerprint

Surface morphology
Chemical analysis
Surface analysis
Metallizing
Contact angle
Surface tension
Energy dispersive spectroscopy
Microscopes
Scanning electron microscopy

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Salleh, M. M., Ahmad, I., Jalar, A., Omar, G., Abdullah, S. H., & Arshad, M. K. (2004). Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. In 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 (pp. 650-655). [1620970] (Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics).
Salleh, Mohamed Mohd ; Ahmad, Ibrahim ; Jalar, Azman ; Omar, Ghazali ; Abdullah, Siti Hajar ; Arshad, Mohd Khairuddin. / Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004. 2004. pp. 650-655 (Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics).
@inproceedings{50318a9644e44fabaf798fdb011d1d99,
title = "Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top",
abstract = "This paper will be discussed some aspects of surface morphology and elemental analysis on the solderability problem which caused non-wetting on top of die metallization layer. In this study few good and bad fresh die will be investigated along with the bad die which have non-wetting at die top. The surface analysis techniques will be used such as optical microscope and SEM to observe surface morphology. EDX investigation being done to determine the elements presents on the samples surface. Further details information using FIB also been performed. Contact angle analysis to measure the surface tension onto related area and FTIR analysis as support techniques.",
author = "Salleh, {Mohamed Mohd} and Ibrahim Ahmad and Azman Jalar and Ghazali Omar and Abdullah, {Siti Hajar} and Arshad, {Mohd Khairuddin}",
year = "2004",
month = "12",
day = "1",
language = "English",
isbn = "0780386582",
series = "Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics",
pages = "650--655",
booktitle = "2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004",

}

Salleh, MM, Ahmad, I, Jalar, A, Omar, G, Abdullah, SH & Arshad, MK 2004, Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. in 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004., 1620970, Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics, pp. 650-655, 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004, Kuala Lumpur, Malaysia, 04/12/04.

Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. / Salleh, Mohamed Mohd; Ahmad, Ibrahim; Jalar, Azman; Omar, Ghazali; Abdullah, Siti Hajar; Arshad, Mohd Khairuddin.

2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004. 2004. p. 650-655 1620970 (Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top

AU - Salleh, Mohamed Mohd

AU - Ahmad, Ibrahim

AU - Jalar, Azman

AU - Omar, Ghazali

AU - Abdullah, Siti Hajar

AU - Arshad, Mohd Khairuddin

PY - 2004/12/1

Y1 - 2004/12/1

N2 - This paper will be discussed some aspects of surface morphology and elemental analysis on the solderability problem which caused non-wetting on top of die metallization layer. In this study few good and bad fresh die will be investigated along with the bad die which have non-wetting at die top. The surface analysis techniques will be used such as optical microscope and SEM to observe surface morphology. EDX investigation being done to determine the elements presents on the samples surface. Further details information using FIB also been performed. Contact angle analysis to measure the surface tension onto related area and FTIR analysis as support techniques.

AB - This paper will be discussed some aspects of surface morphology and elemental analysis on the solderability problem which caused non-wetting on top of die metallization layer. In this study few good and bad fresh die will be investigated along with the bad die which have non-wetting at die top. The surface analysis techniques will be used such as optical microscope and SEM to observe surface morphology. EDX investigation being done to determine the elements presents on the samples surface. Further details information using FIB also been performed. Contact angle analysis to measure the surface tension onto related area and FTIR analysis as support techniques.

UR - http://www.scopus.com/inward/record.url?scp=51349085028&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=51349085028&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:51349085028

SN - 0780386582

SN - 9780780386587

T3 - Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics

SP - 650

EP - 655

BT - 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004

ER -

Salleh MM, Ahmad I, Jalar A, Omar G, Abdullah SH, Arshad MK. Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. In 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004. 2004. p. 650-655. 1620970. (Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics).