Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top

Mohamed Mohd Salleh, Ibrahim Ahmad, Azman Jalar, Ghazali Omar, Siti Hajar Abdullah, Mohd Khairuddin Arshad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper will be discussed some aspects of surface morphology and elemental analysis on the solderability problem which caused non-wetting on top of die metallization layer. In this study few good and bad fresh die will be investigated along with the bad die which have non-wetting at die top. The surface analysis techniques will be used such as optical microscope and SEM to observe surface morphology. EDX investigation being done to determine the elements presents on the samples surface. Further details information using FIB also been performed. Contact angle analysis to measure the surface tension onto related area and FTIR analysis as support techniques.

Original languageEnglish
Title of host publication2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
Pages650-655
Number of pages6
Publication statusPublished - 01 Dec 2004
Event2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 - Kuala Lumpur, Malaysia
Duration: 04 Dec 200409 Dec 2004

Publication series

NameProceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics

Other

Other2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
CountryMalaysia
CityKuala Lumpur
Period04/12/0409/12/04

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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  • Cite this

    Salleh, M. M., Ahmad, I., Jalar, A., Omar, G., Abdullah, S. H., & Arshad, M. K. (2004). Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. In 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 (pp. 650-655). [1620970] (Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics).