Solder joint strength of lead free solders under multiple reflow and high temperature storage condition

Ibrahim Ahmad, Azman Jalar, Burhanuddin Yeop Majlis, Eu Poh Leng, Yong Soo San

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Solder Joining is one of the interconnection methods in microelectronic packaging. The robustness of the solder ball attachment to the packages determines the solder joint strength between solders and the Under-Bump Metallization (UBM). This paper discussed the solder joint shear strength between Sn/4.0/0.5Cu with containing 20-50 ppm Phosporus and Sn/3.8Ag/0.7Cu deposited onto selective plating Ni/Au surface finish TBGA packages. Both were reflowed at a peak reflow temperature of 245±5°C with soaking time 70 second above 220°C. Ball shear testing along with failure mode analysis is used as a destructive method to assess solder joint strength and integrity. Both Sn -Ag-Cu (SAC) were studied under multiple reflow (1×, 2×, 3×, 6×) and high temperature storage (HTS) test at 24, 48, 96 hours. All samples were cross-sectioned to study the IMC thickness that leads to solder joint embrittlement. As a result, Sn/3.8Ag/0.7Cu performs better shear strength after HTS test than Sn/4.0/0.5Cu. Similarly, both show the decreasing of shear strength with increasing number of reflow cycles, supported by IMC thickness measurement that there is no significant different in term of growth and consistency.

Original languageEnglish
Title of host publicationICSE 2006
Subtitle of host publication2006 IEEE International Conference on Semiconductor Electronics, Proceedings
Pages541-544
Number of pages4
DOIs
Publication statusPublished - 01 Dec 2006
Event2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006 - Kuala Lumpur, Malaysia
Duration: 29 Nov 200601 Dec 2006

Publication series

NameIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

Other

Other2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006
CountryMalaysia
CityKuala Lumpur
Period29/11/0601/12/06

Fingerprint

Soldering alloys
Shear strength
Temperature
Thickness measurement
Embrittlement
Metallizing
Lead-free solders
Plating
Microelectronics
Joining
Failure modes
Packaging
Testing

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Ahmad, I., Jalar, A., Majlis, B. Y., Leng, E. P., & San, Y. S. (2006). Solder joint strength of lead free solders under multiple reflow and high temperature storage condition. In ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings (pp. 541-544). [4266672] (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE). https://doi.org/10.1109/SMELEC.2006.380689
Ahmad, Ibrahim ; Jalar, Azman ; Majlis, Burhanuddin Yeop ; Leng, Eu Poh ; San, Yong Soo. / Solder joint strength of lead free solders under multiple reflow and high temperature storage condition. ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings. 2006. pp. 541-544 (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE).
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title = "Solder joint strength of lead free solders under multiple reflow and high temperature storage condition",
abstract = "Solder Joining is one of the interconnection methods in microelectronic packaging. The robustness of the solder ball attachment to the packages determines the solder joint strength between solders and the Under-Bump Metallization (UBM). This paper discussed the solder joint shear strength between Sn/4.0/0.5Cu with containing 20-50 ppm Phosporus and Sn/3.8Ag/0.7Cu deposited onto selective plating Ni/Au surface finish TBGA packages. Both were reflowed at a peak reflow temperature of 245±5°C with soaking time 70 second above 220°C. Ball shear testing along with failure mode analysis is used as a destructive method to assess solder joint strength and integrity. Both Sn -Ag-Cu (SAC) were studied under multiple reflow (1×, 2×, 3×, 6×) and high temperature storage (HTS) test at 24, 48, 96 hours. All samples were cross-sectioned to study the IMC thickness that leads to solder joint embrittlement. As a result, Sn/3.8Ag/0.7Cu performs better shear strength after HTS test than Sn/4.0/0.5Cu. Similarly, both show the decreasing of shear strength with increasing number of reflow cycles, supported by IMC thickness measurement that there is no significant different in term of growth and consistency.",
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Ahmad, I, Jalar, A, Majlis, BY, Leng, EP & San, YS 2006, Solder joint strength of lead free solders under multiple reflow and high temperature storage condition. in ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings., 4266672, IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE, pp. 541-544, 2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006, Kuala Lumpur, Malaysia, 29/11/06. https://doi.org/10.1109/SMELEC.2006.380689

Solder joint strength of lead free solders under multiple reflow and high temperature storage condition. / Ahmad, Ibrahim; Jalar, Azman; Majlis, Burhanuddin Yeop; Leng, Eu Poh; San, Yong Soo.

ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings. 2006. p. 541-544 4266672 (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - Solder Joining is one of the interconnection methods in microelectronic packaging. The robustness of the solder ball attachment to the packages determines the solder joint strength between solders and the Under-Bump Metallization (UBM). This paper discussed the solder joint shear strength between Sn/4.0/0.5Cu with containing 20-50 ppm Phosporus and Sn/3.8Ag/0.7Cu deposited onto selective plating Ni/Au surface finish TBGA packages. Both were reflowed at a peak reflow temperature of 245±5°C with soaking time 70 second above 220°C. Ball shear testing along with failure mode analysis is used as a destructive method to assess solder joint strength and integrity. Both Sn -Ag-Cu (SAC) were studied under multiple reflow (1×, 2×, 3×, 6×) and high temperature storage (HTS) test at 24, 48, 96 hours. All samples were cross-sectioned to study the IMC thickness that leads to solder joint embrittlement. As a result, Sn/3.8Ag/0.7Cu performs better shear strength after HTS test than Sn/4.0/0.5Cu. Similarly, both show the decreasing of shear strength with increasing number of reflow cycles, supported by IMC thickness measurement that there is no significant different in term of growth and consistency.

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Ahmad I, Jalar A, Majlis BY, Leng EP, San YS. Solder joint strength of lead free solders under multiple reflow and high temperature storage condition. In ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings. 2006. p. 541-544. 4266672. (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE). https://doi.org/10.1109/SMELEC.2006.380689