Process optimization approach in fine pitch Cu wire bonding

B. K. Wong, C. C. Yong, P. L. Eu, Boon Kar Yap

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

With SiO2 dielectric under aluminum pads, a 60 m bond pad pitch with 52 um bond pad opening Cu wire bonding process was developed in PBGA Hip 7 PGE wafer technology. The critical factors (wire type, capillary, and bonding parameter) and critical responses (bonded ball diameter, bonded ball height, wire pull, ball shear and number of metal lift/peeling and ball lift after wire pull) are affecting bonding quality. Design of experiment and response of surface were used to optimize the bonding parameters. The wire pull and ball shear test at three thermal aging read points were studied.

Original languageEnglish
Title of host publicationProceedings - 2011 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2011
Pages147-151
Number of pages5
DOIs
Publication statusPublished - 03 Nov 2011
Event2011 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2011 - Kuala Lumpur, Malaysia
Duration: 25 Apr 201127 Apr 2011

Other

Other2011 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2011
CountryMalaysia
CityKuala Lumpur
Period25/04/1127/04/11

Fingerprint

Wire
Thermal aging
Peeling
Design of experiments
Aluminum
Metals

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Hardware and Architecture
  • Software
  • Electrical and Electronic Engineering

Cite this

Wong, B. K., Yong, C. C., Eu, P. L., & Yap, B. K. (2011). Process optimization approach in fine pitch Cu wire bonding. In Proceedings - 2011 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2011 (pp. 147-151). [5959077] https://doi.org/10.1109/ICEDSA.2011.5959077
Wong, B. K. ; Yong, C. C. ; Eu, P. L. ; Yap, Boon Kar. / Process optimization approach in fine pitch Cu wire bonding. Proceedings - 2011 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2011. 2011. pp. 147-151
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Wong, BK, Yong, CC, Eu, PL & Yap, BK 2011, Process optimization approach in fine pitch Cu wire bonding. in Proceedings - 2011 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2011., 5959077, pp. 147-151, 2011 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2011, Kuala Lumpur, Malaysia, 25/04/11. https://doi.org/10.1109/ICEDSA.2011.5959077

Process optimization approach in fine pitch Cu wire bonding. / Wong, B. K.; Yong, C. C.; Eu, P. L.; Yap, Boon Kar.

Proceedings - 2011 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2011. 2011. p. 147-151 5959077.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Wong BK, Yong CC, Eu PL, Yap BK. Process optimization approach in fine pitch Cu wire bonding. In Proceedings - 2011 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2011. 2011. p. 147-151. 5959077 https://doi.org/10.1109/ICEDSA.2011.5959077