Optimization of nickel thickness on substrate for TBGA using SAC387 solder material

Ibrahim Ahmad, B. Y. Majlis, A. Jalar, Eu Poh Leng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The purpose of this paper is to discuss the effect of Nickel (Ni) thickness on lead free solder joint material for tape ball grid array (TBGA) application. In this study, four different level of Nickel thickness were chose that is 3um, 4um, 5um and 6 um. Ball pull testing was used to assess the solder joint performance at time zero, after multiple reflow and high temperature storage (HTS). The machine that was used for the ball pull test is Dage 4000 series. A design of experiment (DOE) based approach is used to study and understand ball pull strength data based on effect of Ni thickness. Statistical results performed shows that 4um is the most preferred thickness for the Ni layer, thus giving a significant effect, supported by thinner Intermetallic layer thickness and area.

Original languageEnglish
Title of host publication32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT
Pages192-194
Number of pages3
DOIs
Publication statusPublished - 01 Dec 2007
Event32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT - San Jose, CA, United States
Duration: 03 Oct 200705 Oct 2007

Publication series

NameProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
ISSN (Print)1089-8190

Other

Other32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT
CountryUnited States
CitySan Jose, CA
Period03/10/0705/10/07

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All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Ahmad, I., Majlis, B. Y., Jalar, A., & Leng, E. P. (2007). Optimization of nickel thickness on substrate for TBGA using SAC387 solder material. In 32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT (pp. 192-194). [4417067] (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium). https://doi.org/10.1109/IEMT.2007.4417067