Abstract
This paper presents the numerical modeling of optical and acoustic wave characterization for a tapered fiber with Finite Element Method. Result focuses on the evolution of surface acoustic wave in the fundamental mode and a higher order acoustic mode behavior of a tapered silica fiber with radius of 2 μm. Result also presents the difference in overlap integral for various fiber radius at different propagation constants. Also, the co-existence of surface acoustic wave and hybrid acoustic wave are simulated at fiber radius of 6 μm. A reliable modeling tool is developed to be utilized in Brillouin characterization for various fibers which is applicable in communication, sensor and amplifier.
| Original language | English |
|---|---|
| Title of host publication | TENCON 2017 - 2017 IEEE Region 10 Conference |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1964-1968 |
| Number of pages | 5 |
| ISBN (Electronic) | 9781509011339 |
| DOIs | |
| Publication status | Published - 19 Dec 2017 |
| Event | 2017 IEEE Region 10 Conference, TENCON 2017 - Penang, Malaysia Duration: 05 Nov 2017 → 08 Nov 2017 |
Publication series
| Name | IEEE Region 10 Annual International Conference, Proceedings/TENCON |
|---|---|
| Volume | 2017-December |
| ISSN (Print) | 2159-3442 |
| ISSN (Electronic) | 2159-3450 |
Other
| Other | 2017 IEEE Region 10 Conference, TENCON 2017 |
|---|---|
| Country | Malaysia |
| City | Penang |
| Period | 05/11/17 → 08/11/17 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Computer Science Applications
- Electrical and Electronic Engineering
Cite this
}
Numerical modeling of surface acoustic wave for silica tapered fiber. / Lee, Hui Jing; Abdullah, Fairuz; Ismail, Aiman.
TENCON 2017 - 2017 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1964-1968 (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2017-December).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Numerical modeling of surface acoustic wave for silica tapered fiber
AU - Lee, Hui Jing
AU - Abdullah, Fairuz
AU - Ismail, Aiman
PY - 2017/12/19
Y1 - 2017/12/19
N2 - This paper presents the numerical modeling of optical and acoustic wave characterization for a tapered fiber with Finite Element Method. Result focuses on the evolution of surface acoustic wave in the fundamental mode and a higher order acoustic mode behavior of a tapered silica fiber with radius of 2 μm. Result also presents the difference in overlap integral for various fiber radius at different propagation constants. Also, the co-existence of surface acoustic wave and hybrid acoustic wave are simulated at fiber radius of 6 μm. A reliable modeling tool is developed to be utilized in Brillouin characterization for various fibers which is applicable in communication, sensor and amplifier.
AB - This paper presents the numerical modeling of optical and acoustic wave characterization for a tapered fiber with Finite Element Method. Result focuses on the evolution of surface acoustic wave in the fundamental mode and a higher order acoustic mode behavior of a tapered silica fiber with radius of 2 μm. Result also presents the difference in overlap integral for various fiber radius at different propagation constants. Also, the co-existence of surface acoustic wave and hybrid acoustic wave are simulated at fiber radius of 6 μm. A reliable modeling tool is developed to be utilized in Brillouin characterization for various fibers which is applicable in communication, sensor and amplifier.
UR - http://www.scopus.com/inward/record.url?scp=85044210379&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85044210379&partnerID=8YFLogxK
U2 - 10.1109/TENCON.2017.8228181
DO - 10.1109/TENCON.2017.8228181
M3 - Conference contribution
AN - SCOPUS:85044210379
T3 - IEEE Region 10 Annual International Conference, Proceedings/TENCON
SP - 1964
EP - 1968
BT - TENCON 2017 - 2017 IEEE Region 10 Conference
PB - Institute of Electrical and Electronics Engineers Inc.
ER -