Numerical modeling of surface acoustic wave for silica tapered fiber

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the numerical modeling of optical and acoustic wave characterization for a tapered fiber with Finite Element Method. Result focuses on the evolution of surface acoustic wave in the fundamental mode and a higher order acoustic mode behavior of a tapered silica fiber with radius of 2 μm. Result also presents the difference in overlap integral for various fiber radius at different propagation constants. Also, the co-existence of surface acoustic wave and hybrid acoustic wave are simulated at fiber radius of 6 μm. A reliable modeling tool is developed to be utilized in Brillouin characterization for various fibers which is applicable in communication, sensor and amplifier.

Original languageEnglish
Title of host publicationTENCON 2017 - 2017 IEEE Region 10 Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1964-1968
Number of pages5
ISBN (Electronic)9781509011339
DOIs
Publication statusPublished - 19 Dec 2017
Event2017 IEEE Region 10 Conference, TENCON 2017 - Penang, Malaysia
Duration: 05 Nov 201708 Nov 2017

Publication series

NameIEEE Region 10 Annual International Conference, Proceedings/TENCON
Volume2017-December
ISSN (Print)2159-3442
ISSN (Electronic)2159-3450

Other

Other2017 IEEE Region 10 Conference, TENCON 2017
CountryMalaysia
CityPenang
Period05/11/1708/11/17

Fingerprint

Surface waves
Silica
Acoustic waves
Fibers
Finite element method
Communication
Sensors

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

Lee, H. J., Abdullah, F., & Ismail, A. (2017). Numerical modeling of surface acoustic wave for silica tapered fiber. In TENCON 2017 - 2017 IEEE Region 10 Conference (pp. 1964-1968). (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2017-December). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.2017.8228181
Lee, Hui Jing ; Abdullah, Fairuz ; Ismail, Aiman. / Numerical modeling of surface acoustic wave for silica tapered fiber. TENCON 2017 - 2017 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1964-1968 (IEEE Region 10 Annual International Conference, Proceedings/TENCON).
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abstract = "This paper presents the numerical modeling of optical and acoustic wave characterization for a tapered fiber with Finite Element Method. Result focuses on the evolution of surface acoustic wave in the fundamental mode and a higher order acoustic mode behavior of a tapered silica fiber with radius of 2 μm. Result also presents the difference in overlap integral for various fiber radius at different propagation constants. Also, the co-existence of surface acoustic wave and hybrid acoustic wave are simulated at fiber radius of 6 μm. A reliable modeling tool is developed to be utilized in Brillouin characterization for various fibers which is applicable in communication, sensor and amplifier.",
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Lee, HJ, Abdullah, F & Ismail, A 2017, Numerical modeling of surface acoustic wave for silica tapered fiber. in TENCON 2017 - 2017 IEEE Region 10 Conference. IEEE Region 10 Annual International Conference, Proceedings/TENCON, vol. 2017-December, Institute of Electrical and Electronics Engineers Inc., pp. 1964-1968, 2017 IEEE Region 10 Conference, TENCON 2017, Penang, Malaysia, 05/11/17. https://doi.org/10.1109/TENCON.2017.8228181

Numerical modeling of surface acoustic wave for silica tapered fiber. / Lee, Hui Jing; Abdullah, Fairuz; Ismail, Aiman.

TENCON 2017 - 2017 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1964-1968 (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2017-December).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Lee HJ, Abdullah F, Ismail A. Numerical modeling of surface acoustic wave for silica tapered fiber. In TENCON 2017 - 2017 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1964-1968. (IEEE Region 10 Annual International Conference, Proceedings/TENCON). https://doi.org/10.1109/TENCON.2017.8228181