Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

Wedianti Shualdi, Badariah Bais, Ibrahim Ahmad, Ghazali Omar, Aishah Isnin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC to ensure the reliability of the solder joints. In this paper, a nanoindentation test was performed at IMCs that grow on the interface between Sn-Ag-Sb lead-free solder alloy and its Cu substrate. The test was done from planar IMC surface. Prior of that, the specimens were subjected to thermal aging process until 1500 hours at 175°C to accelerate the growth of IMC. The nanotest was executed on specimens with completed aging time for 100, 200, 400, 800 and 1500 hours. Nanoindentation results in this paper show the hardness and Young modulus of IMC composition as a whole, without interpretation of hardness properties of Cu3Sn and Cu6Sn5 individually. The hardness of Sn-Ag-Sb/Cu Substrate IMC Layer is decreasing from 5.583 GPa to4.444 GPa while the Young modulus is decreasing from 106.475 GPa to 128.439 GPa.

Original languageEnglish
Title of host publication2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts
Pages220-223
Number of pages4
DOIs
Publication statusPublished - 22 Dec 2011
Event2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011 - Kota Kinabalu, Sabah, Malaysia
Duration: 28 Sep 201130 Sep 2011

Publication series

Name2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts

Other

Other2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011
CountryMalaysia
CityKota Kinabalu, Sabah
Period28/09/1130/09/11

Fingerprint

Thermal aging
Nanoindentation
Intermetallics
Substrates
Hardness
Elastic moduli
Polychlorinated biphenyls
Soldering alloys
Aging of materials
Cracks
Mechanical properties
Chemical analysis

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Shualdi, W., Bais, B., Ahmad, I., Omar, G., & Isnin, A. (2011). Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging. In 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts (pp. 220-223). [6088328] (2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts). https://doi.org/10.1109/RSM.2011.6088328
Shualdi, Wedianti ; Bais, Badariah ; Ahmad, Ibrahim ; Omar, Ghazali ; Isnin, Aishah. / Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging. 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. pp. 220-223 (2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts).
@inproceedings{4797d54f322840509f4246995c01aa88,
title = "Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging",
abstract = "Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC to ensure the reliability of the solder joints. In this paper, a nanoindentation test was performed at IMCs that grow on the interface between Sn-Ag-Sb lead-free solder alloy and its Cu substrate. The test was done from planar IMC surface. Prior of that, the specimens were subjected to thermal aging process until 1500 hours at 175°C to accelerate the growth of IMC. The nanotest was executed on specimens with completed aging time for 100, 200, 400, 800 and 1500 hours. Nanoindentation results in this paper show the hardness and Young modulus of IMC composition as a whole, without interpretation of hardness properties of Cu3Sn and Cu6Sn5 individually. The hardness of Sn-Ag-Sb/Cu Substrate IMC Layer is decreasing from 5.583 GPa to4.444 GPa while the Young modulus is decreasing from 106.475 GPa to 128.439 GPa.",
author = "Wedianti Shualdi and Badariah Bais and Ibrahim Ahmad and Ghazali Omar and Aishah Isnin",
year = "2011",
month = "12",
day = "22",
doi = "10.1109/RSM.2011.6088328",
language = "English",
isbn = "9781612848464",
series = "2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts",
pages = "220--223",
booktitle = "2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts",

}

Shualdi, W, Bais, B, Ahmad, I, Omar, G & Isnin, A 2011, Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging. in 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts., 6088328, 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts, pp. 220-223, 2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011, Kota Kinabalu, Sabah, Malaysia, 28/09/11. https://doi.org/10.1109/RSM.2011.6088328

Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging. / Shualdi, Wedianti; Bais, Badariah; Ahmad, Ibrahim; Omar, Ghazali; Isnin, Aishah.

2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. p. 220-223 6088328 (2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

AU - Shualdi, Wedianti

AU - Bais, Badariah

AU - Ahmad, Ibrahim

AU - Omar, Ghazali

AU - Isnin, Aishah

PY - 2011/12/22

Y1 - 2011/12/22

N2 - Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC to ensure the reliability of the solder joints. In this paper, a nanoindentation test was performed at IMCs that grow on the interface between Sn-Ag-Sb lead-free solder alloy and its Cu substrate. The test was done from planar IMC surface. Prior of that, the specimens were subjected to thermal aging process until 1500 hours at 175°C to accelerate the growth of IMC. The nanotest was executed on specimens with completed aging time for 100, 200, 400, 800 and 1500 hours. Nanoindentation results in this paper show the hardness and Young modulus of IMC composition as a whole, without interpretation of hardness properties of Cu3Sn and Cu6Sn5 individually. The hardness of Sn-Ag-Sb/Cu Substrate IMC Layer is decreasing from 5.583 GPa to4.444 GPa while the Young modulus is decreasing from 106.475 GPa to 128.439 GPa.

AB - Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC to ensure the reliability of the solder joints. In this paper, a nanoindentation test was performed at IMCs that grow on the interface between Sn-Ag-Sb lead-free solder alloy and its Cu substrate. The test was done from planar IMC surface. Prior of that, the specimens were subjected to thermal aging process until 1500 hours at 175°C to accelerate the growth of IMC. The nanotest was executed on specimens with completed aging time for 100, 200, 400, 800 and 1500 hours. Nanoindentation results in this paper show the hardness and Young modulus of IMC composition as a whole, without interpretation of hardness properties of Cu3Sn and Cu6Sn5 individually. The hardness of Sn-Ag-Sb/Cu Substrate IMC Layer is decreasing from 5.583 GPa to4.444 GPa while the Young modulus is decreasing from 106.475 GPa to 128.439 GPa.

UR - http://www.scopus.com/inward/record.url?scp=83755196515&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=83755196515&partnerID=8YFLogxK

U2 - 10.1109/RSM.2011.6088328

DO - 10.1109/RSM.2011.6088328

M3 - Conference contribution

SN - 9781612848464

T3 - 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts

SP - 220

EP - 223

BT - 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts

ER -

Shualdi W, Bais B, Ahmad I, Omar G, Isnin A. Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging. In 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. p. 220-223. 6088328. (2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts). https://doi.org/10.1109/RSM.2011.6088328