Abstract
In electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) solder bump system, the nickel UBM and solder deposition aspects, are two of the most important factors affecting the stability of solder joints. In this study solder bump shearing strength, materials interaction and inter-metallic compound (IMC) growth of Al/electroless Ni immersion gold/solder bumps were investigated with respect to multiple-reflow conditions. Three different chemical composition of lead free solder balls were used for investigate with the multiple reflow effect of 1, 2, 3, 4, 5, 7 and 10 times. Solder materials were selected for this study, were Sn3.8Ag0.7Cu, Sn0.07Cu and Sn3.5Ag, along with Sn37Pb as a reference. Results show that, shearing strength of Pb-free solders in stable condition with multiple reflow effect and indicated that Sn-Ag-Cu has the highest shearing strength and Sn-Cu is the lowest. Sn-Ag system has a compatible shearing value with the Sn-Pb. During reflow process, the formations of Ni-Sn IMC are detected at the nickel and solder material interfaces and the IMC thickness increased with multiple reflow.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005 |
| Pages | 726-730 |
| Number of pages | 5 |
| Publication status | Published - 01 Dec 2005 |
| Event | 38th International Symposium on Microelectronics, IMAPS 2005 - Philadelphia, PA, United States Duration: 25 Sep 2005 → 29 Sep 2005 |
Publication series
| Name | Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005 |
|---|
Other
| Other | 38th International Symposium on Microelectronics, IMAPS 2005 |
|---|---|
| Country | United States |
| City | Philadelphia, PA |
| Period | 25/09/05 → 29/09/05 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
Cite this
}
Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump. / Salleh, Mohamed Mohd; Ahmad, Ibrahim; Jalar, Azman; Omar, Ghazali.
Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. 2005. p. 726-730 (Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump
AU - Salleh, Mohamed Mohd
AU - Ahmad, Ibrahim
AU - Jalar, Azman
AU - Omar, Ghazali
PY - 2005/12/1
Y1 - 2005/12/1
N2 - In electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) solder bump system, the nickel UBM and solder deposition aspects, are two of the most important factors affecting the stability of solder joints. In this study solder bump shearing strength, materials interaction and inter-metallic compound (IMC) growth of Al/electroless Ni immersion gold/solder bumps were investigated with respect to multiple-reflow conditions. Three different chemical composition of lead free solder balls were used for investigate with the multiple reflow effect of 1, 2, 3, 4, 5, 7 and 10 times. Solder materials were selected for this study, were Sn3.8Ag0.7Cu, Sn0.07Cu and Sn3.5Ag, along with Sn37Pb as a reference. Results show that, shearing strength of Pb-free solders in stable condition with multiple reflow effect and indicated that Sn-Ag-Cu has the highest shearing strength and Sn-Cu is the lowest. Sn-Ag system has a compatible shearing value with the Sn-Pb. During reflow process, the formations of Ni-Sn IMC are detected at the nickel and solder material interfaces and the IMC thickness increased with multiple reflow.
AB - In electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) solder bump system, the nickel UBM and solder deposition aspects, are two of the most important factors affecting the stability of solder joints. In this study solder bump shearing strength, materials interaction and inter-metallic compound (IMC) growth of Al/electroless Ni immersion gold/solder bumps were investigated with respect to multiple-reflow conditions. Three different chemical composition of lead free solder balls were used for investigate with the multiple reflow effect of 1, 2, 3, 4, 5, 7 and 10 times. Solder materials were selected for this study, were Sn3.8Ag0.7Cu, Sn0.07Cu and Sn3.5Ag, along with Sn37Pb as a reference. Results show that, shearing strength of Pb-free solders in stable condition with multiple reflow effect and indicated that Sn-Ag-Cu has the highest shearing strength and Sn-Cu is the lowest. Sn-Ag system has a compatible shearing value with the Sn-Pb. During reflow process, the formations of Ni-Sn IMC are detected at the nickel and solder material interfaces and the IMC thickness increased with multiple reflow.
UR - http://www.scopus.com/inward/record.url?scp=84876901360&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84876901360&partnerID=8YFLogxK
M3 - Conference contribution
SN - 0930815777
SN - 9780930815776
T3 - Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005
SP - 726
EP - 730
BT - Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005
ER -