Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition

M. Najib Harif, Ibrahim Ahmad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387), Sn2.3Ag0.08Ni0.01Co (SANC), and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contain 8 balls. From all the samples, result shows that the mean pull strength for high temperature storage are 2847.66g, 2628.20g and 2613.79g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, intermetallic compound (IMC) thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit, and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139μm, 2.3111 μm and 2.3931 μm. It was found that IMC thickness for SANC and Sn3.5Ag does not show significant growth after high temperature storage but SAC387 demonstrated significant growth. Lower intermetallic thickness implies less brittle joint effect, thus from this part of study, better joint reliability is expected for the Sn3.5Ag solder system. In summary pull test method is feasible to be used in characterization in terms of solder joint strength of lead free solder joint material for semiconductor packaging. It also determined ball pull test results provide correlation of the IMC thickness and solder joint strength material.

Original languageEnglish
Title of host publication2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2010 - Proceedings
Pages331-334
Number of pages4
DOIs
Publication statusPublished - 2010
Event2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA2010 - Kuala Lumpur, Malaysia
Duration: 12 Apr 201013 Apr 2010

Other

Other2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA2010
CountryMalaysia
CityKuala Lumpur
Period12/04/1013/04/10

Fingerprint

Intermetallics
Packaging
Semiconductor materials
Mechanical properties
Soldering alloys
Ball grid arrays
Temperature
Lead-free solders
Hot Temperature
Statistical methods
Experiments

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Harif, M. N., & Ahmad, I. (2010). Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition. In 2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2010 - Proceedings (pp. 331-334). [5503049] https://doi.org/10.1109/ICEDSA.2010.5503049
Harif, M. Najib ; Ahmad, Ibrahim. / Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition. 2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2010 - Proceedings. 2010. pp. 331-334
@inproceedings{cb02fe1116dd4d3eac2581ae43c74a67,
title = "Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition",
abstract = "The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387), Sn2.3Ag0.08Ni0.01Co (SANC), and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contain 8 balls. From all the samples, result shows that the mean pull strength for high temperature storage are 2847.66g, 2628.20g and 2613.79g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, intermetallic compound (IMC) thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit, and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139μm, 2.3111 μm and 2.3931 μm. It was found that IMC thickness for SANC and Sn3.5Ag does not show significant growth after high temperature storage but SAC387 demonstrated significant growth. Lower intermetallic thickness implies less brittle joint effect, thus from this part of study, better joint reliability is expected for the Sn3.5Ag solder system. In summary pull test method is feasible to be used in characterization in terms of solder joint strength of lead free solder joint material for semiconductor packaging. It also determined ball pull test results provide correlation of the IMC thickness and solder joint strength material.",
author = "Harif, {M. Najib} and Ibrahim Ahmad",
year = "2010",
doi = "10.1109/ICEDSA.2010.5503049",
language = "English",
isbn = "9781424466320",
pages = "331--334",
booktitle = "2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2010 - Proceedings",

}

Harif, MN & Ahmad, I 2010, Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition. in 2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2010 - Proceedings., 5503049, pp. 331-334, 2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA2010, Kuala Lumpur, Malaysia, 12/04/10. https://doi.org/10.1109/ICEDSA.2010.5503049

Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition. / Harif, M. Najib; Ahmad, Ibrahim.

2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2010 - Proceedings. 2010. p. 331-334 5503049.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition

AU - Harif, M. Najib

AU - Ahmad, Ibrahim

PY - 2010

Y1 - 2010

N2 - The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387), Sn2.3Ag0.08Ni0.01Co (SANC), and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contain 8 balls. From all the samples, result shows that the mean pull strength for high temperature storage are 2847.66g, 2628.20g and 2613.79g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, intermetallic compound (IMC) thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit, and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139μm, 2.3111 μm and 2.3931 μm. It was found that IMC thickness for SANC and Sn3.5Ag does not show significant growth after high temperature storage but SAC387 demonstrated significant growth. Lower intermetallic thickness implies less brittle joint effect, thus from this part of study, better joint reliability is expected for the Sn3.5Ag solder system. In summary pull test method is feasible to be used in characterization in terms of solder joint strength of lead free solder joint material for semiconductor packaging. It also determined ball pull test results provide correlation of the IMC thickness and solder joint strength material.

AB - The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387), Sn2.3Ag0.08Ni0.01Co (SANC), and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contain 8 balls. From all the samples, result shows that the mean pull strength for high temperature storage are 2847.66g, 2628.20g and 2613.79g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, intermetallic compound (IMC) thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit, and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139μm, 2.3111 μm and 2.3931 μm. It was found that IMC thickness for SANC and Sn3.5Ag does not show significant growth after high temperature storage but SAC387 demonstrated significant growth. Lower intermetallic thickness implies less brittle joint effect, thus from this part of study, better joint reliability is expected for the Sn3.5Ag solder system. In summary pull test method is feasible to be used in characterization in terms of solder joint strength of lead free solder joint material for semiconductor packaging. It also determined ball pull test results provide correlation of the IMC thickness and solder joint strength material.

UR - http://www.scopus.com/inward/record.url?scp=77955288873&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77955288873&partnerID=8YFLogxK

U2 - 10.1109/ICEDSA.2010.5503049

DO - 10.1109/ICEDSA.2010.5503049

M3 - Conference contribution

SN - 9781424466320

SP - 331

EP - 334

BT - 2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2010 - Proceedings

ER -

Harif MN, Ahmad I. Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition. In 2010 International Conference on Electronic Devices, Systems and Applications, ICEDSA 2010 - Proceedings. 2010. p. 331-334. 5503049 https://doi.org/10.1109/ICEDSA.2010.5503049