Abstract
Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is coated with a layer or organic coating to prevent wire-to-wire short. In this paper we analyze the reliability of insulated Cu wire with diameter of 20 μm in PBGA package under unbiased HAST, TC and HTS reliability stressing using standard, touched wires profile and extreme loop height without kinks profile. Ball shear, wire pull and stitch pull tests as well as Cu/Al IMC thickness measurement test w performed after reliability stressing for bare Cu and insulated Cu wire samples. Results show that insulated Cu wire reliability samples show similar ball bond strength performance after the ball shear and wire pull test. Although stitch pull strength of insulated Cu is ∼17% less than bare Cu samples, the reliability results indicate that insulated Cu stitch bond has good reliability. Effect of the capillary touchdowns to the ball and stitch bond integrity of bare Cu and insulated Cu wire bonding is also presented in this paper. Capillary residue build up on the tip surface was investigated. We found capillary condition and life are comparable to bare Cu wire capillary.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 215-219 |
| Number of pages | 5 |
| ISBN (Electronic) | 9781479969944 |
| DOIs | |
| Publication status | Published - 30 Jan 2014 |
| Event | 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 - Singapore, Singapore Duration: 03 Dec 2014 → 05 Dec 2014 |
Publication series
| Name | Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 |
|---|
Other
| Other | 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 |
|---|---|
| Country | Singapore |
| City | Singapore |
| Period | 03/12/14 → 05/12/14 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
Cite this
}
Manufacturability readiness of insulated Cu wire bonding process in PBGA package. / Hungyang, Leong; Yap, Boon Kar; Yong, Tan Chou; Khan, Navas; Ibrahim, Mohd Rusli; Tan, L. C.
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 215-219 7028288 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Manufacturability readiness of insulated Cu wire bonding process in PBGA package
AU - Hungyang, Leong
AU - Yap, Boon Kar
AU - Yong, Tan Chou
AU - Khan, Navas
AU - Ibrahim, Mohd Rusli
AU - Tan, L. C.
PY - 2014/1/30
Y1 - 2014/1/30
N2 - Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is coated with a layer or organic coating to prevent wire-to-wire short. In this paper we analyze the reliability of insulated Cu wire with diameter of 20 μm in PBGA package under unbiased HAST, TC and HTS reliability stressing using standard, touched wires profile and extreme loop height without kinks profile. Ball shear, wire pull and stitch pull tests as well as Cu/Al IMC thickness measurement test w performed after reliability stressing for bare Cu and insulated Cu wire samples. Results show that insulated Cu wire reliability samples show similar ball bond strength performance after the ball shear and wire pull test. Although stitch pull strength of insulated Cu is ∼17% less than bare Cu samples, the reliability results indicate that insulated Cu stitch bond has good reliability. Effect of the capillary touchdowns to the ball and stitch bond integrity of bare Cu and insulated Cu wire bonding is also presented in this paper. Capillary residue build up on the tip surface was investigated. We found capillary condition and life are comparable to bare Cu wire capillary.
AB - Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is coated with a layer or organic coating to prevent wire-to-wire short. In this paper we analyze the reliability of insulated Cu wire with diameter of 20 μm in PBGA package under unbiased HAST, TC and HTS reliability stressing using standard, touched wires profile and extreme loop height without kinks profile. Ball shear, wire pull and stitch pull tests as well as Cu/Al IMC thickness measurement test w performed after reliability stressing for bare Cu and insulated Cu wire samples. Results show that insulated Cu wire reliability samples show similar ball bond strength performance after the ball shear and wire pull test. Although stitch pull strength of insulated Cu is ∼17% less than bare Cu samples, the reliability results indicate that insulated Cu stitch bond has good reliability. Effect of the capillary touchdowns to the ball and stitch bond integrity of bare Cu and insulated Cu wire bonding is also presented in this paper. Capillary residue build up on the tip surface was investigated. We found capillary condition and life are comparable to bare Cu wire capillary.
UR - http://www.scopus.com/inward/record.url?scp=84946693646&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84946693646&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2014.7028288
DO - 10.1109/EPTC.2014.7028288
M3 - Conference contribution
T3 - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
SP - 215
EP - 219
BT - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
ER -