Manufacturability readiness of insulated Cu wire bonding process in PBGA package

Leong Hungyang, Boon Kar Yap, Tan Chou Yong, Navas Khan, Mohd Rusli Ibrahim, L. C. Tan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is coated with a layer or organic coating to prevent wire-to-wire short. In this paper we analyze the reliability of insulated Cu wire with diameter of 20 μm in PBGA package under unbiased HAST, TC and HTS reliability stressing using standard, touched wires profile and extreme loop height without kinks profile. Ball shear, wire pull and stitch pull tests as well as Cu/Al IMC thickness measurement test w performed after reliability stressing for bare Cu and insulated Cu wire samples. Results show that insulated Cu wire reliability samples show similar ball bond strength performance after the ball shear and wire pull test. Although stitch pull strength of insulated Cu is ∼17% less than bare Cu samples, the reliability results indicate that insulated Cu stitch bond has good reliability. Effect of the capillary touchdowns to the ball and stitch bond integrity of bare Cu and insulated Cu wire bonding is also presented in this paper. Capillary residue build up on the tip surface was investigated. We found capillary condition and life are comparable to bare Cu wire capillary.

Original languageEnglish
Title of host publicationProceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages215-219
Number of pages5
ISBN (Electronic)9781479969944
DOIs
Publication statusPublished - 30 Jan 2014
Event2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 - Singapore, Singapore
Duration: 03 Dec 201405 Dec 2014

Publication series

NameProceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

Other

Other2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014
CountrySingapore
CitySingapore
Period03/12/1405/12/14

Fingerprint

Wire
Organic coatings
Thickness measurement
Bond strength (materials)
Microelectronics

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Hungyang, L., Yap, B. K., Yong, T. C., Khan, N., Ibrahim, M. R., & Tan, L. C. (2014). Manufacturability readiness of insulated Cu wire bonding process in PBGA package. In Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 (pp. 215-219). [7028288] (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2014.7028288
Hungyang, Leong ; Yap, Boon Kar ; Yong, Tan Chou ; Khan, Navas ; Ibrahim, Mohd Rusli ; Tan, L. C. / Manufacturability readiness of insulated Cu wire bonding process in PBGA package. Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 215-219 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).
@inproceedings{2b70c9febf274469b94ce54a5cd86e46,
title = "Manufacturability readiness of insulated Cu wire bonding process in PBGA package",
abstract = "Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is coated with a layer or organic coating to prevent wire-to-wire short. In this paper we analyze the reliability of insulated Cu wire with diameter of 20 μm in PBGA package under unbiased HAST, TC and HTS reliability stressing using standard, touched wires profile and extreme loop height without kinks profile. Ball shear, wire pull and stitch pull tests as well as Cu/Al IMC thickness measurement test w performed after reliability stressing for bare Cu and insulated Cu wire samples. Results show that insulated Cu wire reliability samples show similar ball bond strength performance after the ball shear and wire pull test. Although stitch pull strength of insulated Cu is ∼17{\%} less than bare Cu samples, the reliability results indicate that insulated Cu stitch bond has good reliability. Effect of the capillary touchdowns to the ball and stitch bond integrity of bare Cu and insulated Cu wire bonding is also presented in this paper. Capillary residue build up on the tip surface was investigated. We found capillary condition and life are comparable to bare Cu wire capillary.",
author = "Leong Hungyang and Yap, {Boon Kar} and Yong, {Tan Chou} and Navas Khan and Ibrahim, {Mohd Rusli} and Tan, {L. C.}",
year = "2014",
month = "1",
day = "30",
doi = "10.1109/EPTC.2014.7028288",
language = "English",
series = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "215--219",
booktitle = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",
address = "United States",

}

Hungyang, L, Yap, BK, Yong, TC, Khan, N, Ibrahim, MR & Tan, LC 2014, Manufacturability readiness of insulated Cu wire bonding process in PBGA package. in Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014., 7028288, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Institute of Electrical and Electronics Engineers Inc., pp. 215-219, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore, 03/12/14. https://doi.org/10.1109/EPTC.2014.7028288

Manufacturability readiness of insulated Cu wire bonding process in PBGA package. / Hungyang, Leong; Yap, Boon Kar; Yong, Tan Chou; Khan, Navas; Ibrahim, Mohd Rusli; Tan, L. C.

Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 215-219 7028288 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Manufacturability readiness of insulated Cu wire bonding process in PBGA package

AU - Hungyang, Leong

AU - Yap, Boon Kar

AU - Yong, Tan Chou

AU - Khan, Navas

AU - Ibrahim, Mohd Rusli

AU - Tan, L. C.

PY - 2014/1/30

Y1 - 2014/1/30

N2 - Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is coated with a layer or organic coating to prevent wire-to-wire short. In this paper we analyze the reliability of insulated Cu wire with diameter of 20 μm in PBGA package under unbiased HAST, TC and HTS reliability stressing using standard, touched wires profile and extreme loop height without kinks profile. Ball shear, wire pull and stitch pull tests as well as Cu/Al IMC thickness measurement test w performed after reliability stressing for bare Cu and insulated Cu wire samples. Results show that insulated Cu wire reliability samples show similar ball bond strength performance after the ball shear and wire pull test. Although stitch pull strength of insulated Cu is ∼17% less than bare Cu samples, the reliability results indicate that insulated Cu stitch bond has good reliability. Effect of the capillary touchdowns to the ball and stitch bond integrity of bare Cu and insulated Cu wire bonding is also presented in this paper. Capillary residue build up on the tip surface was investigated. We found capillary condition and life are comparable to bare Cu wire capillary.

AB - Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is coated with a layer or organic coating to prevent wire-to-wire short. In this paper we analyze the reliability of insulated Cu wire with diameter of 20 μm in PBGA package under unbiased HAST, TC and HTS reliability stressing using standard, touched wires profile and extreme loop height without kinks profile. Ball shear, wire pull and stitch pull tests as well as Cu/Al IMC thickness measurement test w performed after reliability stressing for bare Cu and insulated Cu wire samples. Results show that insulated Cu wire reliability samples show similar ball bond strength performance after the ball shear and wire pull test. Although stitch pull strength of insulated Cu is ∼17% less than bare Cu samples, the reliability results indicate that insulated Cu stitch bond has good reliability. Effect of the capillary touchdowns to the ball and stitch bond integrity of bare Cu and insulated Cu wire bonding is also presented in this paper. Capillary residue build up on the tip surface was investigated. We found capillary condition and life are comparable to bare Cu wire capillary.

UR - http://www.scopus.com/inward/record.url?scp=84946693646&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84946693646&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2014.7028288

DO - 10.1109/EPTC.2014.7028288

M3 - Conference contribution

T3 - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

SP - 215

EP - 219

BT - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Hungyang L, Yap BK, Yong TC, Khan N, Ibrahim MR, Tan LC. Manufacturability readiness of insulated Cu wire bonding process in PBGA package. In Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 215-219. 7028288. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014). https://doi.org/10.1109/EPTC.2014.7028288