Lead-free flux effect in lead-free solder joint improvement

Poh Leng Eu, Min Ding, Ibrahim Ahmad, Huey Jiun Hoh, Kamarudin Hazlinda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Lead-free flux used in lead-free solder ball attachment process has been found to play a vital role in improving lead-free solder joint robustness & performance. In this study, two water soluble lead-free solder ball attach fluxes, flux A & flux B, each from different supplier, were compared in terms of the following characteristics: time variation of flux properties, flux stability vs. temperature change, flux wetting through Ni/Au reflow coupon test, and flux performance during & after ball attach process. It was also found that ball attach reflow profile has to be optimized for individual flux type according to the flux properties. Result shows that lead-free flux B performs better than flux A in terms of flux stability over time & temperature, wetting ability, cold ball pull (CBP) & ball shear result with lower brittle fracture rate.

Original languageEnglish
Title of host publicationProceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology
Pages541-548
Number of pages8
DOIs
Publication statusPublished - 2006
Event31st International Electronics Manufacturing Technology Conference, IEMT 2006 - Petaling Jaya, Malaysia
Duration: 08 Nov 200610 Nov 2006

Other

Other31st International Electronics Manufacturing Technology Conference, IEMT 2006
CountryMalaysia
CityPetaling Jaya
Period08/11/0610/11/06

Fingerprint

Lead
Fluxes
Lead-free solders
Wetting
Brittle fracture
Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Eu, P. L., Ding, M., Ahmad, I., Hoh, H. J., & Hazlinda, K. (2006). Lead-free flux effect in lead-free solder joint improvement. In Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology (pp. 541-548). [4456509] https://doi.org/10.1109/IEMT.2006.4456509
Eu, Poh Leng ; Ding, Min ; Ahmad, Ibrahim ; Hoh, Huey Jiun ; Hazlinda, Kamarudin. / Lead-free flux effect in lead-free solder joint improvement. Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology. 2006. pp. 541-548
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Eu, PL, Ding, M, Ahmad, I, Hoh, HJ & Hazlinda, K 2006, Lead-free flux effect in lead-free solder joint improvement. in Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology., 4456509, pp. 541-548, 31st International Electronics Manufacturing Technology Conference, IEMT 2006, Petaling Jaya, Malaysia, 08/11/06. https://doi.org/10.1109/IEMT.2006.4456509

Lead-free flux effect in lead-free solder joint improvement. / Eu, Poh Leng; Ding, Min; Ahmad, Ibrahim; Hoh, Huey Jiun; Hazlinda, Kamarudin.

Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology. 2006. p. 541-548 4456509.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - Lead-free flux used in lead-free solder ball attachment process has been found to play a vital role in improving lead-free solder joint robustness & performance. In this study, two water soluble lead-free solder ball attach fluxes, flux A & flux B, each from different supplier, were compared in terms of the following characteristics: time variation of flux properties, flux stability vs. temperature change, flux wetting through Ni/Au reflow coupon test, and flux performance during & after ball attach process. It was also found that ball attach reflow profile has to be optimized for individual flux type according to the flux properties. Result shows that lead-free flux B performs better than flux A in terms of flux stability over time & temperature, wetting ability, cold ball pull (CBP) & ball shear result with lower brittle fracture rate.

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Eu PL, Ding M, Ahmad I, Hoh HJ, Hazlinda K. Lead-free flux effect in lead-free solder joint improvement. In Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology. 2006. p. 541-548. 4456509 https://doi.org/10.1109/IEMT.2006.4456509