Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Boon Kar Yap, Noor Azrina Talik, Zaliman Sauli, Foong Chee Seng, Tan Chou Yong, Vithyacharan Retnasamy

Research output: Contribution to journalArticle

Abstract

Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology/approach - Thus, the flux-cleaning process was implemented and the cleanliness effect was evaluated. Cleaning experiments using a new water-based solvent were carried out to investigate the flux-cleaning efficiency. The test packages were then evaluated via ion chromatography (IC). Findings - Ion chromatograms show that there are high levels of ionic elements detected prior to the cleaning process. After the cleaning process, the contamination levels reduced significantly. Originality/value - The value of the work here is testing of the new environmental friendly water-based MPC cleaning efficiency. The reduction of ionic contamination is thus reported.

Original languageEnglish
Article number17086474
Pages (from-to)99-103
Number of pages5
JournalMicroelectronics International
Volume30
Issue number2
DOIs
Publication statusPublished - 26 Aug 2013

Fingerprint

cleaning
Cleaning
contamination
Contamination
chips
Fluxes
Ion chromatography
cleanliness
Ball grid arrays
Water
chromatography
water
attachment
balls
ions
Lead
grids
methodology
Ions
Testing

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Yap, Boon Kar ; Talik, Noor Azrina ; Sauli, Zaliman ; Seng, Foong Chee ; Yong, Tan Chou ; Retnasamy, Vithyacharan. / Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology. In: Microelectronics International. 2013 ; Vol. 30, No. 2. pp. 99-103.
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Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology. / Yap, Boon Kar; Talik, Noor Azrina; Sauli, Zaliman; Seng, Foong Chee; Yong, Tan Chou; Retnasamy, Vithyacharan.

In: Microelectronics International, Vol. 30, No. 2, 17086474, 26.08.2013, p. 99-103.

Research output: Contribution to journalArticle

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