Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish

Poh Leng Eu, Min Ding, Ibrahim Ahmad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Sn3.5Ag and Sn3.8Ag0.7Cu (SAC387) Pb-free solder alloys on Ni/Au BGA pad finishing were studied for manufacturability, component mechanical robustness and board level reliability. Reflow profile windowing study showed that both alloys would form solder joint properly with profiles with peak temperature over 230°C. At individual solder joint level, Sn3.5Ag showed significantly lower intermetallic brittle failure rate compared to SAC387 in cold ball pull test. At package level, Sn3.5Ag survived 8∼10x more drop cycles than SAC387 in tray drop and packing drop tests. These results indicate that the mechanical strength of Sn3.5Ag on Ni/Au pad is considerably stronger than that of SAC387. The difference in mechanical strength between the two alloys was correlated to their microstructures. At the same time, board level solder joint reliability tests such as thermal cycling and mechanical bend test were carried out. Sn3.5Ag showed similar performance compared to SAC387.

Original languageEnglish
Title of host publicationProceedings - 2007 International Symposium on Microelectronics, IMAPS 2007
Pages534-541
Number of pages8
Publication statusPublished - 01 Dec 2007
Event40th International Symposium on Microelectronics, IMAPS 2007 - San Jose, CA, United States
Duration: 11 Nov 200715 Nov 2007

Publication series

NameProceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Other

Other40th International Symposium on Microelectronics, IMAPS 2007
CountryUnited States
CitySan Jose, CA
Period11/11/0715/11/07

Fingerprint

Soldering alloys
Strength of materials
Thermal cycling
Intermetallics
Microstructure
Temperature
Lead-free solders

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Eu, P. L., Ding, M., & Ahmad, I. (2007). Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish. In Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007 (pp. 534-541). (Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007).
Eu, Poh Leng ; Ding, Min ; Ahmad, Ibrahim. / Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish. Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007. 2007. pp. 534-541 (Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007).
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abstract = "Sn3.5Ag and Sn3.8Ag0.7Cu (SAC387) Pb-free solder alloys on Ni/Au BGA pad finishing were studied for manufacturability, component mechanical robustness and board level reliability. Reflow profile windowing study showed that both alloys would form solder joint properly with profiles with peak temperature over 230°C. At individual solder joint level, Sn3.5Ag showed significantly lower intermetallic brittle failure rate compared to SAC387 in cold ball pull test. At package level, Sn3.5Ag survived 8∼10x more drop cycles than SAC387 in tray drop and packing drop tests. These results indicate that the mechanical strength of Sn3.5Ag on Ni/Au pad is considerably stronger than that of SAC387. The difference in mechanical strength between the two alloys was correlated to their microstructures. At the same time, board level solder joint reliability tests such as thermal cycling and mechanical bend test were carried out. Sn3.5Ag showed similar performance compared to SAC387.",
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Eu, PL, Ding, M & Ahmad, I 2007, Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish. in Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007. Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007, pp. 534-541, 40th International Symposium on Microelectronics, IMAPS 2007, San Jose, CA, United States, 11/11/07.

Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish. / Eu, Poh Leng; Ding, Min; Ahmad, Ibrahim.

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007. 2007. p. 534-541 (Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Eu PL, Ding M, Ahmad I. Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish. In Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007. 2007. p. 534-541. (Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007).