Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

Wedianti Shualdi, Ibrahim Ahmad, Ghazali Omar, Aishah Isnin

Research output: Contribution to journalArticle

Abstract

Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject to thermal aging are reported. The thicknesses of interfacial Ni-Cu-Sn IMC compounds were observed after exposed to 50, 100, 200, 400 and 800 hours aging time. The temperature for the thermal aging was kept constant at 175°C. It was noted that IMC layers grew in thickness as the thermal aging time increased. The highest IMC layer thickness was observed at 800 hours thermal aging time. At 800 hours aging time, the formation of voids was obvious and base metal-rich compound was also found at certain location probably due to grain boundary diffusion effect.

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Thermal aging
Intermetallics
Packaging
Aging of materials
Electronics packaging
Crack initiation
Soldering alloys
Grain boundaries
Nickel
Metals
Temperature

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

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title = "Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging",
abstract = "Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject to thermal aging are reported. The thicknesses of interfacial Ni-Cu-Sn IMC compounds were observed after exposed to 50, 100, 200, 400 and 800 hours aging time. The temperature for the thermal aging was kept constant at 175°C. It was noted that IMC layers grew in thickness as the thermal aging time increased. The highest IMC layer thickness was observed at 800 hours thermal aging time. At 800 hours aging time, the formation of voids was obvious and base metal-rich compound was also found at certain location probably due to grain boundary diffusion effect.",
author = "Wedianti Shualdi and Ibrahim Ahmad and Ghazali Omar and Aishah Isnin",
year = "2008",
doi = "10.1109/IEMT.2008.5507783",
language = "English",
journal = "Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium",
issn = "1089-8190",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

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T1 - Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

AU - Shualdi, Wedianti

AU - Ahmad, Ibrahim

AU - Omar, Ghazali

AU - Isnin, Aishah

PY - 2008

Y1 - 2008

N2 - Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject to thermal aging are reported. The thicknesses of interfacial Ni-Cu-Sn IMC compounds were observed after exposed to 50, 100, 200, 400 and 800 hours aging time. The temperature for the thermal aging was kept constant at 175°C. It was noted that IMC layers grew in thickness as the thermal aging time increased. The highest IMC layer thickness was observed at 800 hours thermal aging time. At 800 hours aging time, the formation of voids was obvious and base metal-rich compound was also found at certain location probably due to grain boundary diffusion effect.

AB - Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject to thermal aging are reported. The thicknesses of interfacial Ni-Cu-Sn IMC compounds were observed after exposed to 50, 100, 200, 400 and 800 hours aging time. The temperature for the thermal aging was kept constant at 175°C. It was noted that IMC layers grew in thickness as the thermal aging time increased. The highest IMC layer thickness was observed at 800 hours thermal aging time. At 800 hours aging time, the formation of voids was obvious and base metal-rich compound was also found at certain location probably due to grain boundary diffusion effect.

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