The finite element method is vastly used in material strength analysis. The nature of the finite element solver, which solves the Fourier equation of stress and strain analysis, made it possible to apply for conduction heat transfer Fourier Equation. Similarly the Current and voltage equation is also liner Fourier equation. The nature of the governing equation makes it possible to numerical investigate the electrical joule heating phenomena in electronic component. This paper highlights the Finite Element Method (FEM) application onto semiconductor interconnects to determine the specific contact resistance (SCR). Metal and semiconductor interconnects is used as model. The result confirms the possibility and validity of FEM utilization to investigate the Joule heating due electrical resistance.
|Journal||IOP Conference Series: Materials Science and Engineering|
|Publication status||Published - 21 Sep 2015|
|Event||7th International Conference on Cooling and Heating Technologies, ICCHT 2014 - Subang Jaya, Selangor Darul Ehsan, Malaysia|
Duration: 04 Nov 2014 → 06 Nov 2014
All Science Journal Classification (ASJC) codes
- Materials Science(all)