Electrical and joule heating relationship investigation using finite element method

Savithry K. Thangaraju, K. M. Munisamy

Research output: Contribution to journalConference article

4 Citations (Scopus)

Abstract

The finite element method is vastly used in material strength analysis. The nature of the finite element solver, which solves the Fourier equation of stress and strain analysis, made it possible to apply for conduction heat transfer Fourier Equation. Similarly the Current and voltage equation is also liner Fourier equation. The nature of the governing equation makes it possible to numerical investigate the electrical joule heating phenomena in electronic component. This paper highlights the Finite Element Method (FEM) application onto semiconductor interconnects to determine the specific contact resistance (SCR). Metal and semiconductor interconnects is used as model. The result confirms the possibility and validity of FEM utilization to investigate the Joule heating due electrical resistance.

Original languageEnglish
Article number012036
JournalIOP Conference Series: Materials Science and Engineering
Volume88
Issue number1
DOIs
Publication statusPublished - 21 Sep 2015
Event7th International Conference on Cooling and Heating Technologies, ICCHT 2014 - Subang Jaya, Selangor Darul Ehsan, Malaysia
Duration: 04 Nov 201406 Nov 2014

Fingerprint

Joule heating
Finite element method
Semiconductor materials
Acoustic impedance
Contact resistance
Heat conduction
Metals
Electric potential

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

Cite this

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Electrical and joule heating relationship investigation using finite element method. / K. Thangaraju, Savithry; Munisamy, K. M.

In: IOP Conference Series: Materials Science and Engineering, Vol. 88, No. 1, 012036, 21.09.2015.

Research output: Contribution to journalConference article

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AB - The finite element method is vastly used in material strength analysis. The nature of the finite element solver, which solves the Fourier equation of stress and strain analysis, made it possible to apply for conduction heat transfer Fourier Equation. Similarly the Current and voltage equation is also liner Fourier equation. The nature of the governing equation makes it possible to numerical investigate the electrical joule heating phenomena in electronic component. This paper highlights the Finite Element Method (FEM) application onto semiconductor interconnects to determine the specific contact resistance (SCR). Metal and semiconductor interconnects is used as model. The result confirms the possibility and validity of FEM utilization to investigate the Joule heating due electrical resistance.

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