Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

Zainudin Kornain, Nowshad Amin, Azman Jalar, Ang Ye Cheah, Ibrahim Ahmad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials provide both physical adhesion and electrical conductivity. Compared to the solder technology, ECA offers numerous advantages, such as environmental friendliness, lower processing temperature, fewer processing steps (reducing processing cost), and especially, the fine pitch capability attributed to the availability of small sized conductive fillers. Here, 70-nm sized silver particle filler (Ag) has been used to study the effect to electrical conductivity of ECA after surface treatment. Upon surface treatment of silver with silane-based coupling agent, the treated silver filled epoxy system demonstrated incredible improvement in electrical properties. The current conductivity (DC) for treated filler was 4.01 S/cm compared with untreated filler with 4.54E-03 S/cm for 5%w filler loading. Morphological studies using light microscopy micrographs have shown perceptible enhancement in filler dispersivity after treatment.

Original languageEnglish
Title of host publicationICSE 2008 Proceedings - 2008 IEEE International Conference on Semiconductor Electronics
Pages549-553
Number of pages5
DOIs
Publication statusPublished - 01 Dec 2008
Event2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008 - Johor Bahru, Johor, Malaysia
Duration: 25 Nov 200827 Nov 2008

Publication series

NameIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

Other

Other2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008
CountryMalaysia
CityJohor Bahru, Johor
Period25/11/0827/11/08

Fingerprint

Silver
Fillers
Adhesives
Nanoparticles
Soldering alloys
Surface treatment
Processing
Silanes
Filler metals
Electronics packaging
Coupling agents
Optical microscopy
Binders
Electric Conductivity
Electric properties
Adhesion
Lead
Availability
Composite materials
Costs

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kornain, Z., Amin, N., Jalar, A., Cheah, A. Y., & Ahmad, I. (2008). Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA). In ICSE 2008 Proceedings - 2008 IEEE International Conference on Semiconductor Electronics (pp. 549-553). [4770385] (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE). https://doi.org/10.1109/SMELEC.2008.4770385
Kornain, Zainudin ; Amin, Nowshad ; Jalar, Azman ; Cheah, Ang Ye ; Ahmad, Ibrahim. / Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA). ICSE 2008 Proceedings - 2008 IEEE International Conference on Semiconductor Electronics. 2008. pp. 549-553 (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE).
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abstract = "Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials provide both physical adhesion and electrical conductivity. Compared to the solder technology, ECA offers numerous advantages, such as environmental friendliness, lower processing temperature, fewer processing steps (reducing processing cost), and especially, the fine pitch capability attributed to the availability of small sized conductive fillers. Here, 70-nm sized silver particle filler (Ag) has been used to study the effect to electrical conductivity of ECA after surface treatment. Upon surface treatment of silver with silane-based coupling agent, the treated silver filled epoxy system demonstrated incredible improvement in electrical properties. The current conductivity (DC) for treated filler was 4.01 S/cm compared with untreated filler with 4.54E-03 S/cm for 5{\%}w filler loading. Morphological studies using light microscopy micrographs have shown perceptible enhancement in filler dispersivity after treatment.",
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Kornain, Z, Amin, N, Jalar, A, Cheah, AY & Ahmad, I 2008, Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA). in ICSE 2008 Proceedings - 2008 IEEE International Conference on Semiconductor Electronics., 4770385, IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE, pp. 549-553, 2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008, Johor Bahru, Johor, Malaysia, 25/11/08. https://doi.org/10.1109/SMELEC.2008.4770385

Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA). / Kornain, Zainudin; Amin, Nowshad; Jalar, Azman; Cheah, Ang Ye; Ahmad, Ibrahim.

ICSE 2008 Proceedings - 2008 IEEE International Conference on Semiconductor Electronics. 2008. p. 549-553 4770385 (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Kornain Z, Amin N, Jalar A, Cheah AY, Ahmad I. Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA). In ICSE 2008 Proceedings - 2008 IEEE International Conference on Semiconductor Electronics. 2008. p. 549-553. 4770385. (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE). https://doi.org/10.1109/SMELEC.2008.4770385