Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength

Poh Leng Eu, Ibrahim Ahmad, A. Jalar, Hazlinda Kamarudin, B. Yeop Majlis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Reflow profile parameter with reducing soaking time demonstrated better solder joint performance in Lead-free BGA semiconductor packages. Hence, this paper studied the lead-free solder joint strength using two different reflow profiles: conventional ramp-soak-peak (RSP) and ramp to peak (RTP) for solder ball attachment. In this study, Sn/3.8Ag/0.7Cu solder balls were re flowed on solder pads with Ni/Au surface finish using these two reflow profiles in a seven zone forced convection oven. Ball shear testing along with failure mode analysis - ductile and brittle failure mode were used to assess solder joint performance at time zero, after multiple reflow and high temperature storage test (HTS). Intermetallic thickness was measured using Image Analyzer. Elemental analysis by EDX detected Cu-Sn phase at IMC peak and Cu-Ni-Sn phase presented at IMC interface. The overall result showed that RTP profile has higher and more consistent solder joint strength, thus giving lower standard deviation and higher Cpk, along with 100% ductile- failure mode and thinner IMC layer. RTP profile has been established as a benchmark of industry' standard. This profile has much shorter soak time during flux activation temperature at 130 °C to 170 °C to prevent flux dry-up and hence enable better flux activation during solder joint formation at peak temperature zone. This will enhance an even intermetallic growth and a stronger <£ more reliable solder joint.

Original languageEnglish
Title of host publicationProceedings - 2006 International Symposium on Microelectronics, IMAPS 2006
Pages385-391
Number of pages7
Publication statusPublished - 2006
Event39th International Symposium on Microelectronics, IMAPS 2006 - San Diego, CA, United States
Duration: 08 Oct 200612 Oct 2006

Other

Other39th International Symposium on Microelectronics, IMAPS 2006
CountryUnited States
CitySan Diego, CA
Period08/10/0612/10/06

Fingerprint

Soldering alloys
Failure modes
Fluxes
Intermetallics
Chemical activation
Forced convection
Ovens
Temperature
Energy dispersive spectroscopy
Lead
Semiconductor materials
Testing
Chemical analysis
Industry

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Eu, P. L., Ahmad, I., Jalar, A., Kamarudin, H., & Majlis, B. Y. (2006). Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength. In Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006 (pp. 385-391)
Eu, Poh Leng ; Ahmad, Ibrahim ; Jalar, A. ; Kamarudin, Hazlinda ; Majlis, B. Yeop. / Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength. Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006. 2006. pp. 385-391
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title = "Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength",
abstract = "Reflow profile parameter with reducing soaking time demonstrated better solder joint performance in Lead-free BGA semiconductor packages. Hence, this paper studied the lead-free solder joint strength using two different reflow profiles: conventional ramp-soak-peak (RSP) and ramp to peak (RTP) for solder ball attachment. In this study, Sn/3.8Ag/0.7Cu solder balls were re flowed on solder pads with Ni/Au surface finish using these two reflow profiles in a seven zone forced convection oven. Ball shear testing along with failure mode analysis - ductile and brittle failure mode were used to assess solder joint performance at time zero, after multiple reflow and high temperature storage test (HTS). Intermetallic thickness was measured using Image Analyzer. Elemental analysis by EDX detected Cu-Sn phase at IMC peak and Cu-Ni-Sn phase presented at IMC interface. The overall result showed that RTP profile has higher and more consistent solder joint strength, thus giving lower standard deviation and higher Cpk, along with 100{\%} ductile- failure mode and thinner IMC layer. RTP profile has been established as a benchmark of industry' standard. This profile has much shorter soak time during flux activation temperature at 130 °C to 170 °C to prevent flux dry-up and hence enable better flux activation during solder joint formation at peak temperature zone. This will enhance an even intermetallic growth and a stronger <£ more reliable solder joint.",
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Eu, PL, Ahmad, I, Jalar, A, Kamarudin, H & Majlis, BY 2006, Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength. in Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006. pp. 385-391, 39th International Symposium on Microelectronics, IMAPS 2006, San Diego, CA, United States, 08/10/06.

Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength. / Eu, Poh Leng; Ahmad, Ibrahim; Jalar, A.; Kamarudin, Hazlinda; Majlis, B. Yeop.

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006. 2006. p. 385-391.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Eu PL, Ahmad I, Jalar A, Kamarudin H, Majlis BY. Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength. In Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006. 2006. p. 385-391