Dicing laminated wafer for QFN 3D stacked die packaging

S. Abdullah, Z. Endut, Ibrahim Ahmad, A. Jalar, S. M. Yusof

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Nowadays, die attach film (DAF) gaining popularity in microelectronic packaging as integral part in facilitating the growth of wafer level packaging and stacked die packaging. DAF applied to the backside of wafers prior to saw have many advantages, such as the elimination of the epoxy dispensed process step and the reduction of epoxy related failure mode. However, the dicing process for DAF wafer usually associated with sidewall chipping, DAF whiskering and crack that will affect reliability of Quad Flat Non-Leaded (QFN) stacked die. Blade properties and characteristics are the crucial factor in analyzing the DAF dicing results. In this paper, we evaluate the blade characteristics before and after DAF wafer dicing process for our stacked die packaging. The qualitative measure by means of the Scanning Electron Microscope (SEM) and Energy Dispersive X-Ray (EDX) analysis were performed in order to understand the lamination and dulling effect on blade surface. The obtained results showed that sawing polymeric material such as wafer laminated with DAF induces lamination of polymeric material onto the blade surface and reduce blade cutting edge. As a result, reduce the quality of DAF dicing process.

Original languageEnglish
Title of host publicationSemiconductor Photonics
Subtitle of host publicationNano-Structured Materials and Devices
PublisherTrans Tech Publications
Pages202-205
Number of pages4
ISBN (Print)0878494715, 9780878494712
DOIs
Publication statusPublished - 01 Jan 2008
EventInternational Conference on Materials for Advanced Technologies, ICMAT 2007 - , Singapore
Duration: 01 Jul 200706 Jul 2007

Publication series

NameAdvanced Materials Research
Volume31
ISSN (Print)1022-6680

Other

OtherInternational Conference on Materials for Advanced Technologies, ICMAT 2007
CountrySingapore
Period01/07/0706/07/07

Fingerprint

Packaging
Sawing
Energy dispersive X ray analysis
Polymers
Microelectronics
Failure modes
Electron microscopes
Cracks
Scanning

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Abdullah, S., Endut, Z., Ahmad, I., Jalar, A., & Yusof, S. M. (2008). Dicing laminated wafer for QFN 3D stacked die packaging. In Semiconductor Photonics: Nano-Structured Materials and Devices (pp. 202-205). (Advanced Materials Research; Vol. 31). Trans Tech Publications. https://doi.org/10.4028/0-87849-471-5.202
Abdullah, S. ; Endut, Z. ; Ahmad, Ibrahim ; Jalar, A. ; Yusof, S. M. / Dicing laminated wafer for QFN 3D stacked die packaging. Semiconductor Photonics: Nano-Structured Materials and Devices. Trans Tech Publications, 2008. pp. 202-205 (Advanced Materials Research).
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Abdullah, S, Endut, Z, Ahmad, I, Jalar, A & Yusof, SM 2008, Dicing laminated wafer for QFN 3D stacked die packaging. in Semiconductor Photonics: Nano-Structured Materials and Devices. Advanced Materials Research, vol. 31, Trans Tech Publications, pp. 202-205, International Conference on Materials for Advanced Technologies, ICMAT 2007, Singapore, 01/07/07. https://doi.org/10.4028/0-87849-471-5.202

Dicing laminated wafer for QFN 3D stacked die packaging. / Abdullah, S.; Endut, Z.; Ahmad, Ibrahim; Jalar, A.; Yusof, S. M.

Semiconductor Photonics: Nano-Structured Materials and Devices. Trans Tech Publications, 2008. p. 202-205 (Advanced Materials Research; Vol. 31).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Abdullah S, Endut Z, Ahmad I, Jalar A, Yusof SM. Dicing laminated wafer for QFN 3D stacked die packaging. In Semiconductor Photonics: Nano-Structured Materials and Devices. Trans Tech Publications. 2008. p. 202-205. (Advanced Materials Research). https://doi.org/10.4028/0-87849-471-5.202