Dicing die attach film for 3D stacked die QFN packages

S. Abdullah, S. Mohd Yusof, Ibrahim Ahmad, A. Jalar, R. Daud

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process become greater and die attach paste may not be suitable in most cases. DAF has many advantages including no die tilt, no void, consistent bond line, no bleed out which improves the real estate on the bottom die. This paper reveals the difference of two types of DAF. In dicing die attach film (DDAF) application for QFN stacked die, there are several common responses so the focus will be elucidated the common defect after lamination process and dicing process. Defect like bubble, whisker formation, adhesive merging and flying die are for lamination process. While, chipping at backside, front side and sidewall, and also crack will be inspected for the dicing process. Lamination parameters such as temperature, pressure and speed will be optimized in order to get the best parameter combination for these two types of DAF. In the dicing process the critical parameter such as spindle rotation, saw speed, and blade grit size will be determined based on experimental works. Qualitative analysis will be carried out in order to understand the chipping, crack, adhesive merging and whisker formation. Tools like high power microscope (50x - 500 x magnificent) and SEM will be used to see those defect. The results that show all two types of DAF give the same response at the same parameter setting were presented and thoroughly discussed.

Original languageEnglish
Title of host publication32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT
Pages73-75
Number of pages3
DOIs
Publication statusPublished - 01 Dec 2007
Event32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT - San Jose, CA, United States
Duration: 03 Oct 200705 Oct 2007

Other

Other32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT
CountryUnited States
CitySan Jose, CA
Period03/10/0705/10/07

Fingerprint

Merging
Defects
Adhesives
Cracks
Packaging
Microscopes
Semiconductor materials
Scanning electron microscopy
Temperature

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Abdullah, S., Mohd Yusof, S., Ahmad, I., Jalar, A., & Daud, R. (2007). Dicing die attach film for 3D stacked die QFN packages. In 32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT (pp. 73-75). [4417054] https://doi.org/10.1109/IEMT.2007.4417054
Abdullah, S. ; Mohd Yusof, S. ; Ahmad, Ibrahim ; Jalar, A. ; Daud, R. / Dicing die attach film for 3D stacked die QFN packages. 32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT. 2007. pp. 73-75
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abstract = "The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process become greater and die attach paste may not be suitable in most cases. DAF has many advantages including no die tilt, no void, consistent bond line, no bleed out which improves the real estate on the bottom die. This paper reveals the difference of two types of DAF. In dicing die attach film (DDAF) application for QFN stacked die, there are several common responses so the focus will be elucidated the common defect after lamination process and dicing process. Defect like bubble, whisker formation, adhesive merging and flying die are for lamination process. While, chipping at backside, front side and sidewall, and also crack will be inspected for the dicing process. Lamination parameters such as temperature, pressure and speed will be optimized in order to get the best parameter combination for these two types of DAF. In the dicing process the critical parameter such as spindle rotation, saw speed, and blade grit size will be determined based on experimental works. Qualitative analysis will be carried out in order to understand the chipping, crack, adhesive merging and whisker formation. Tools like high power microscope (50x - 500 x magnificent) and SEM will be used to see those defect. The results that show all two types of DAF give the same response at the same parameter setting were presented and thoroughly discussed.",
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Abdullah, S, Mohd Yusof, S, Ahmad, I, Jalar, A & Daud, R 2007, Dicing die attach film for 3D stacked die QFN packages. in 32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT., 4417054, pp. 73-75, 32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT, San Jose, CA, United States, 03/10/07. https://doi.org/10.1109/IEMT.2007.4417054

Dicing die attach film for 3D stacked die QFN packages. / Abdullah, S.; Mohd Yusof, S.; Ahmad, Ibrahim; Jalar, A.; Daud, R.

32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT. 2007. p. 73-75 4417054.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Abdullah S, Mohd Yusof S, Ahmad I, Jalar A, Daud R. Dicing die attach film for 3D stacked die QFN packages. In 32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT. 2007. p. 73-75. 4417054 https://doi.org/10.1109/IEMT.2007.4417054