Characterisation of insulated Cu wire ball bonding

H. Y. Leong, Boon Kar Yap, N. Khan, M. R. Ibrahim, L. C. Tan, M. Faiz

Research output: Contribution to journalArticle

Abstract

Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and bare Cu wire ball-bonding process characterisation in the standpoints of free air ball formation, Al splash, hardness, ball bond strength and intermetallic growth at the bond interface study. Spherical and clean free air ball was formed using lower electric flame off energy compared to bare Cu wire. The study shows that insulated Cu bonding demonstrated comparable equivalent ball bond strength to bare Cu wire bonding at T0 and even after subjected to isothermal aging 175°C up to 1008 hours. Intermetallic formation was uniform at the bond interface for both wires. Insulated Cu wire demonstrates good bondability and reliability performance, suitable for fine pitch wire bonding in large-scale integration applications.

Original languageEnglish
Pages (from-to)S6-269-S6-273
JournalMaterials Research Innovations
Volume18
DOIs
Publication statusPublished - 18 Dec 2014

Fingerprint

balls
wire
Wire
Bond strength (materials)
Intermetallics
intermetallics
Insulated wire
LSI circuits
large scale integration
Air
air
flames
Aging of materials
Hardness
hardness
insulators
Coatings
coatings

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Leong, H. Y., Yap, B. K., Khan, N., Ibrahim, M. R., Tan, L. C., & Faiz, M. (2014). Characterisation of insulated Cu wire ball bonding. Materials Research Innovations, 18, S6-269-S6-273. https://doi.org/10.1179/1432891714Z.0000000001019
Leong, H. Y. ; Yap, Boon Kar ; Khan, N. ; Ibrahim, M. R. ; Tan, L. C. ; Faiz, M. / Characterisation of insulated Cu wire ball bonding. In: Materials Research Innovations. 2014 ; Vol. 18. pp. S6-269-S6-273.
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Characterisation of insulated Cu wire ball bonding. / Leong, H. Y.; Yap, Boon Kar; Khan, N.; Ibrahim, M. R.; Tan, L. C.; Faiz, M.

In: Materials Research Innovations, Vol. 18, 18.12.2014, p. S6-269-S6-273.

Research output: Contribution to journalArticle

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