Alternative double pass dicing method for thin wafer laminated with die attach film

Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper introduces an alternative dicing method to reduce lateral crack and chipping problem in dicing 100pm thickness wafer laminated with die attach film (DAF). Conventional single pass saw process caused lateral crack due to excessive over loading of the epoxy on the blade. To overcome this problem, an alternative method of double pass saw process was proposed to reduce the blade loading. A set of experiments was carried outto determine the saw depth of the first and second pass. Chipping and cracks were characterized using measuring scope and observed with scanning electron microscopy (SEM). Results have shown that the method is more effective and able to reduce almost 80% of the chip/lateral crack as compared to single pass process.

Original languageEnglish
Title of host publication2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
Pages636-641
Number of pages6
Publication statusPublished - 01 Dec 2004
Event2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 - Kuala Lumpur, Malaysia
Duration: 04 Dec 200409 Dec 2004

Publication series

NameProceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics

Other

Other2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
CountryMalaysia
CityKuala Lumpur
Period04/12/0409/12/04

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Jiun, H. H., Ahmad, I., Jalar, A., & Omar, G. (2004). Alternative double pass dicing method for thin wafer laminated with die attach film. In 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 (pp. 636-641). [1620967] (Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics).