Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance

Poh Leng Eu, Min Ding, Huey Jiun Hoh, Ibrahim Ahmad, Kamarudin Hazlinda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A comparison study was done between Cold Ball Pull (CBP) test vs. the conventional ball shear test to further understand the advantages & challenges of CBP test as a method to assess lead-free solder joint performance. From this study, CBP was found to be a better and preferred tool that is able to identify poor lead free solder joint and hence to differentiate the performance of lead free solder systems. This study also outlined the challenges of implementing CBP test as a standard monitoring tool in production floor which lead to the usage of CBP test merely as an engineering monitoring tool at this point.

Original languageEnglish
Title of host publicationProceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology
Pages534-540
Number of pages7
DOIs
Publication statusPublished - 01 Dec 2006
Event31st International Electronics Manufacturing Technology Conference, IEMT 2006 - Petaling Jaya, Malaysia
Duration: 08 Nov 200610 Nov 2006

Other

Other31st International Electronics Manufacturing Technology Conference, IEMT 2006
CountryMalaysia
CityPetaling Jaya
Period08/11/0610/11/06

Fingerprint

Monitoring
Lead-free solders

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Eu, P. L., Ding, M., Hoh, H. J., Ahmad, I., & Hazlinda, K. (2006). Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance. In Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology (pp. 534-540). [4456508] https://doi.org/10.1109/IEMT.2006.4456508
Eu, Poh Leng ; Ding, Min ; Hoh, Huey Jiun ; Ahmad, Ibrahim ; Hazlinda, Kamarudin. / Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance. Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology. 2006. pp. 534-540
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Eu, PL, Ding, M, Hoh, HJ, Ahmad, I & Hazlinda, K 2006, Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance. in Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology., 4456508, pp. 534-540, 31st International Electronics Manufacturing Technology Conference, IEMT 2006, Petaling Jaya, Malaysia, 08/11/06. https://doi.org/10.1109/IEMT.2006.4456508

Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance. / Eu, Poh Leng; Ding, Min; Hoh, Huey Jiun; Ahmad, Ibrahim; Hazlinda, Kamarudin.

Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology. 2006. p. 534-540 4456508.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Eu PL, Ding M, Hoh HJ, Ahmad I, Hazlinda K. Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance. In Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology. 2006. p. 534-540. 4456508 https://doi.org/10.1109/IEMT.2006.4456508