Abstract
This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and Differential Scanning Calorimetry (DSC) respectively. Overall results indicates that Sn3.8Ag0.7Cu having the most favorable results with highest shear strength, narrow melting peak and low surface oxidation. Further works done to understand in depth of the microstructure and elemental properties reveals that Sn3.8Ag0.7Cu has dendritic microstructure with Ag-Sn plate and Cu-Ni-Sn IMC interface.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology |
| Pages | 450-455 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 01 Dec 2006 |
| Event | 31st International Electronics Manufacturing Technology Conference, IEMT 2006 - Petaling Jaya, Malaysia Duration: 08 Nov 2006 → 10 Nov 2006 |
Publication series
| Name | Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium |
|---|---|
| ISSN (Print) | 1089-8190 |
Other
| Other | 31st International Electronics Manufacturing Technology Conference, IEMT 2006 |
|---|---|
| Country | Malaysia |
| City | Petaling Jaya |
| Period | 08/11/06 → 10/11/06 |
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All Science Journal Classification (ASJC) codes
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
Cite this
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A study on lead free SnAgCu solder system. / Hoh, Huey Jiun; Eu, Poh Leng; Ding, Min; Ahmad, Ibrahim.
Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology. 2006. p. 450-455 4456493 (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - A study on lead free SnAgCu solder system
AU - Hoh, Huey Jiun
AU - Eu, Poh Leng
AU - Ding, Min
AU - Ahmad, Ibrahim
PY - 2006/12/1
Y1 - 2006/12/1
N2 - This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and Differential Scanning Calorimetry (DSC) respectively. Overall results indicates that Sn3.8Ag0.7Cu having the most favorable results with highest shear strength, narrow melting peak and low surface oxidation. Further works done to understand in depth of the microstructure and elemental properties reveals that Sn3.8Ag0.7Cu has dendritic microstructure with Ag-Sn plate and Cu-Ni-Sn IMC interface.
AB - This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and Differential Scanning Calorimetry (DSC) respectively. Overall results indicates that Sn3.8Ag0.7Cu having the most favorable results with highest shear strength, narrow melting peak and low surface oxidation. Further works done to understand in depth of the microstructure and elemental properties reveals that Sn3.8Ag0.7Cu has dendritic microstructure with Ag-Sn plate and Cu-Ni-Sn IMC interface.
UR - http://www.scopus.com/inward/record.url?scp=50249182786&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50249182786&partnerID=8YFLogxK
U2 - 10.1109/IEMT.2006.4456493
DO - 10.1109/IEMT.2006.4456493
M3 - Conference contribution
AN - SCOPUS:50249182786
SN - 142440729X
SN - 9781424407293
T3 - Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
SP - 450
EP - 455
BT - Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology
ER -