A study on lead free SnAgCu solder system

Huey Jiun Hoh, Poh Leng Eu, Min Ding, Ibrahim Ahmad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and Differential Scanning Calorimetry (DSC) respectively. Overall results indicates that Sn3.8Ag0.7Cu having the most favorable results with highest shear strength, narrow melting peak and low surface oxidation. Further works done to understand in depth of the microstructure and elemental properties reveals that Sn3.8Ag0.7Cu has dendritic microstructure with Ag-Sn plate and Cu-Ni-Sn IMC interface.

Original languageEnglish
Title of host publicationProceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology
Pages450-455
Number of pages6
DOIs
Publication statusPublished - 2006
Event31st International Electronics Manufacturing Technology Conference, IEMT 2006 - Petaling Jaya, Malaysia
Duration: 08 Nov 200610 Nov 2006

Other

Other31st International Electronics Manufacturing Technology Conference, IEMT 2006
CountryMalaysia
CityPetaling Jaya
Period08/11/0610/11/06

Fingerprint

Shear strength
Soldering alloys
Melting
Microstructure
Differential scanning calorimetry
Thermodynamic properties
Oxidation
Mechanical properties
Oxides
Chemical analysis
Lead-free solders

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Hoh, H. J., Eu, P. L., Ding, M., & Ahmad, I. (2006). A study on lead free SnAgCu solder system. In Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology (pp. 450-455). [4456493] https://doi.org/10.1109/IEMT.2006.4456493
Hoh, Huey Jiun ; Eu, Poh Leng ; Ding, Min ; Ahmad, Ibrahim. / A study on lead free SnAgCu solder system. Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology. 2006. pp. 450-455
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Hoh, HJ, Eu, PL, Ding, M & Ahmad, I 2006, A study on lead free SnAgCu solder system. in Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology., 4456493, pp. 450-455, 31st International Electronics Manufacturing Technology Conference, IEMT 2006, Petaling Jaya, Malaysia, 08/11/06. https://doi.org/10.1109/IEMT.2006.4456493

A study on lead free SnAgCu solder system. / Hoh, Huey Jiun; Eu, Poh Leng; Ding, Min; Ahmad, Ibrahim.

Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology. 2006. p. 450-455 4456493.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and Differential Scanning Calorimetry (DSC) respectively. Overall results indicates that Sn3.8Ag0.7Cu having the most favorable results with highest shear strength, narrow melting peak and low surface oxidation. Further works done to understand in depth of the microstructure and elemental properties reveals that Sn3.8Ag0.7Cu has dendritic microstructure with Ag-Sn plate and Cu-Ni-Sn IMC interface.

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Hoh HJ, Eu PL, Ding M, Ahmad I. A study on lead free SnAgCu solder system. In Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology. 2006. p. 450-455. 4456493 https://doi.org/10.1109/IEMT.2006.4456493