A study on inter-metallic compound formation and structure of lead free SnAgCu solder system

Ibrahim Ahmad, Hoh Huey Jiun, Eu Poh Leng, B. Y. Majlis, A. Jalar, R. Wagiran

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that 1wt%Ag 0.5wt%Cu has larger melting range compared to 3 & 4wt%Ag 0.5wt%Cu which could contribute to IMC growth. Relatively, ball shear results shows that shear strength increases with Ag wt% content. A correlation between melting range and shear results made in this study pointed to 3.8wt%Ag0.5wt%Cu having the most favorable results.

Original languageEnglish
Title of host publicationICSE 2006
Subtitle of host publication2006 IEEE International Conference on Semiconductor Electronics, Proceedings
Pages545-548
Number of pages4
DOIs
Publication statusPublished - 2006
Event2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006 - Kuala Lumpur, Malaysia
Duration: 29 Nov 200601 Dec 2006

Other

Other2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006
CountryMalaysia
CityKuala Lumpur
Period29/11/0601/12/06

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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    Ahmad, I., Jiun, H. H., Leng, E. P., Majlis, B. Y., Jalar, A., & Wagiran, R. (2006). A study on inter-metallic compound formation and structure of lead free SnAgCu solder system. In ICSE 2006: 2006 IEEE International Conference on Semiconductor Electronics, Proceedings (pp. 545-548). [4266673] https://doi.org/10.1109/SMELEC.2006.380690